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Method for increasing uniformity of photolithography energy and improving splicing

A technology with uniform energy and photolithography, which is applied in microlithography exposure equipment, optics, and optomechanical equipment, etc., can solve problems such as image deformation in the splicing area, reduced production capacity, and reduced refresh rate of spatial light modulators, achieving a wide range of applications , the effect of high productivity

Active Publication Date: 2018-05-22
俞庆平
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  • Application Information

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Problems solved by technology

However, the method in this patent improves the uniformity of light at the cost of greatly reducing the refresh rate of the spatial light modulator-the refresh rate of the spatial light modulator is 32K in the case of monochrome images, and the spatial light modulator in grayscale mode The refresh rate of the light modulator is only 1.9K, which greatly reduces the production capacity; at the same time, this method of gray scale compensation cannot be effectively applied to the exposure system of scanning mode
[0004] In addition, when using SLM as a pattern generator, the stitching problem between scan strips is unavoidable, which will lead to image distortion in the stitched area
In the invention patent with the publication number of patent CN 104536269A in my country, a method of splicing and improving using the SLM triangular area is proposed, but this processing method can only be applied to oblique scanning, and cannot be applied to vertical scanning; this method is very important for improving Light uniformity within the exposure field also has no effect

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  • Method for increasing uniformity of photolithography energy and improving splicing
  • Method for increasing uniformity of photolithography energy and improving splicing
  • Method for increasing uniformity of photolithography energy and improving splicing

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Embodiment Construction

[0029] The technical solutions of the present invention will be clearly and completely described below in conjunction with specific implementation methods and accompanying drawings. The following are specific embodiments of the present invention.

[0030] The invention provides a method for improving photolithography energy uniformity and splicing, which is suitable for a photolithography system using an area array spatial light modulator (SLM) as a pattern generator for scanning exposure.

[0031] The scanning exposure in this embodiment includes oblique scanning and vertical scanning. The schematic diagrams of the two scanning methods are as follows: figure 1 shown. The difference between the two scanning methods is that in vertical scanning, the area array SLM has an axis parallel to the scanning direction, while in oblique scanning, each axis of the area array SLM has an angle greater than zero with the scanning direction.

[0032] The area array spatial light modulator...

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Abstract

The invention discloses a method for increasing the uniformity of photolithography energy and improving splicing and a potolithographic system suitable for scanning exposure by using an area array spatial light modulator as a graphic generator. The process comprises the following steps: an acquisition module acquires energy data of the scanning exposure process, an operation module analyzes the energy data, a single line energy distribution map is formed, splicing area energy merging is performed, and characteristic parameters in an unit area of the single line energy distribution map after the energy is merged are extracted; according to the characteristic parameters, the number of target opening times of pixel units in the area array spatial light modulator is calculated, and the operation module transfers the number of the target opening times to a data processing system; the data processing system controls opening or closing of each pixel unit of the area array spatial light modulator according to the number of the target opening times. The method can improve the brightness balance effect and improve the splicing effect without changing the scanning speed or affecting the productivity. The method is also suitable for both inclined scanning and vertical scanning, and has wider application range.

Description

technical field [0001] The invention relates to the technical field of direct writing photolithography systems, in particular to a method for improving photolithography energy uniformity and splicing. Background technique [0002] Direct writing lithography equipment, also known as direct image transfer equipment, is an important equipment in the field of semiconductor and printed circuit board (PCB) production that is different from traditional semi-automatic exposure equipment. It uses a pattern generator to replace the mask plate of the traditional lithography machine, so that the graphic data of the computer can be directly exposed to the wafer or PCB board, saving the time of board making and the cost of making the mask plate, and it can be used as a mask plate itself. . At present, the devices of most manufacturers use the spatial light modulator (SLM) as the pattern generator. The SLM includes a digital micromirror device (DMD) and a liquid crystal display (LCD). Th...

Claims

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F7/2051G03F7/704G03F7/70475G03F7/70558
Inventor 俞庆平
Owner 俞庆平