Flexible printed circuit protection glue and preparation method thereof

A technology of protective glue and glue phase, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problem of poor heat resistance and aging resistance of flexible circuit boards, three-layer glued flexible board base Limitations in the field of materials, affecting the electrical properties of FPC flexible boards, etc., to achieve the effect of being conducive to industrialized large-scale production, simple and easy preparation methods, and easy processing

Inactive Publication Date: 2018-05-29
JIN GUANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to increase the flexibility of the flexible circuit board, a large amount of nitrile rubber must be added. Due to the large amount of rubber, the heat resistance and aging resistance of the flexible circuit board are poor, and the dimensional stability is not good, and it is easy to cause heat and oxidation. And the decomposition caused by it, and the rubber contains more ionic impurities, which seriously affects the electrical properties of the FPC flexible board. Long-term use limits the field of the three-layer rubber flexible board base material.

Method used

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  • Flexible printed circuit protection glue and preparation method thereof

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preparation example Construction

[0022] In addition, for the protective glue provided by the present invention, the applicant specially designed a preparation method, including the following steps:

[0023] S101: weighing each raw material component in proportion, and then grinding until the particle size of each raw material is less than or equal to 100 nm.

[0024] S102: Stir the ground raw material components evenly under sealed conditions to obtain a protective glue.

[0025] Describe below in conjunction with specific implementation manner:

Embodiment 1

[0027] The invention provides a flexible printed circuit protective adhesive. The raw material components are calculated in parts by weight, including: 3300 parts by weight of aluminum oxide, 3600 parts by weight of iron oxide, 6500 parts by weight of plastic, 3500 parts by weight of metal glue, and 420 parts by weight of softener , 16 parts by weight of dibutyltin dilaurate active liquid, 105 parts by weight of A900, 140 parts by weight of OPM800, and 10 parts by weight of KBM438.

[0028] Protective glue is prepared according to the method provided by the invention, comprising the following steps:

[0029] S101: weighing each raw material component in proportion, and then grinding until the particle size of each raw material is less than or equal to 100 nm.

[0030] S102: Stir the ground raw material components evenly under sealed conditions to obtain a protective glue.

Embodiment 2

[0032] The invention provides a flexible printed circuit protective adhesive. The raw material components are calculated in parts by weight, including: 3220 parts by weight of aluminum oxide, 4000 parts by weight of iron oxide, 6000 parts by weight of plastic, 4000 parts by weight of metal glue, and 390 parts by weight of softener , 20 parts by weight of dibutyltin dilaurate active solution, 95 parts by weight of A900, 160 parts by weight of OPM800, and 8 parts by weight of KBM438.

[0033] Protective glue is prepared according to the method provided by the invention, comprising the following steps:

[0034] S101: weighing each raw material component in proportion, and then grinding until the particle size of each raw material is less than or equal to 100 nm.

[0035] S102: Stir the ground raw material components evenly under sealed conditions to obtain a protective glue.

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Abstract

The invention relates to flexible printed circuit protection glue and a preparation method thereof. The protection glue is prepared from the following raw material components: 3220-3300 parts by weight of aluminum oxide, 3600-4000 parts by weight of ferric oxide, 6000-6500 parts by weight of plastic, 3500-4000 parts by weight of metal glue, 390-420 parts by weight of a softener, 16-20 parts by weight of a metal tin active solution, 95-105 parts by weight of a lubricant, 140-160 parts by weight of a flame retardant and 8-10 parts by weight of a solvent. The preparation method comprises the following steps: proportionally weighing all raw material components, and then, grinding the raw material components until the particle sizes of all raw materials are less than or equal to 100nm; and uniformly stirring all ground raw material components under a sealed condition so as to obtain the protection glue. The protection glue provided by the invention combines the advantages of high temperature resistance, strong adhesion property of metal or glass and plastic, flame resistance, smooth printing surface, high durability, electricity resistance and the like, and can be effectively used for equipment containing flexible printed circuits.

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to a flexible printed circuit protective glue and a preparation method thereof. Background technique [0002] In recent years, with the vigorous development of semiconductor technology and material science, the application of driver chips and flexible circuit boards has become more and more extensive. Flexible printed circuit boards are flexible and bendable, so they can be embedded in conductors in various shapes to meet the needs of equipment, and then electrically connect two electronic components. [0003] FPC flexible printed circuit is a highly reliable and excellent flexible printed circuit made of polyimide or polyester film; while traditional soft board materials are mainly polyimide The three-layer structure of film / adhesive / copper foil is the main structure. Generally, the adhesive is an adhesive made of epoxy resin, curing agent, and nitrile rubber, which is...

Claims

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Application Information

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IPC IPC(8): C09J201/00C09J11/04C09J11/06
CPCC09J201/00C08K5/57C08K13/02C08K2003/2227C08K2003/2265C09J11/04C09J11/06
Inventor 金光
Owner JIN GUANG
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