Light-cured resin for 3D (Three-dimensional) printing

A light-curing resin and 3D printing technology, applied in the direction of additive processing, etc., can solve problems such as affecting accuracy and part deformation, and achieve the effects of improving molding accuracy, improving mechanical properties, and reducing shrinkage

Active Publication Date: 2018-06-01
XI AN JIAOTONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the change of the internal molecular structure of the light-curing resin during the curing process, curing shrinkage occurs, which leads to deformation of the parts and affects the accuracy

Method used

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  • Light-cured resin for 3D (Three-dimensional) printing
  • Light-cured resin for 3D (Three-dimensional) printing
  • Light-cured resin for 3D (Three-dimensional) printing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A 3D printing photocurable resin, wherein the mass percentages of each component are: 30% bisphenol A type E-51 epoxy resin, 20% alicyclic epoxy resin, 5% 1,6-hexanediol diacrylic acid Esters, 5% trimethylolpropane triacrylate, 20% 3-hydroxymethyl-1-oxetane, 10% 2-hydroxymethyloxetane, 5% benzoin dimethyl ether, 5 % Rigid Polysiloxane.

Embodiment 2

[0018] A 3D printing photocurable resin, wherein the mass percentages of each component are: 30% bisphenol A type E-51 epoxy resin, 30% alicyclic epoxy resin, 10% 1,6-hexanediol diacrylic acid Esters, 5% trimethylolpropane triacrylate, 6% 3-hydroxymethyl-1-oxetane, 6% 2-hydroxymethyloxetane, 5% benzoin dimethyl ether, 8 % Rigid Polysiloxane.

Embodiment 3

[0020] A 3D printing photocurable resin, wherein the mass percentages of each component are: 40% bisphenol A type E-51 epoxy resin, 30% alicyclic epoxy resin, 5% 1,6-hexanediol diacrylic acid Esters, 5% trimethylolpropane triacrylate, 5% 3-hydroxymethyl-1-oxetane, 5% 2-hydroxymethyloxetane, 5% benzoin dimethyl ether, 5% % Rigid Polysiloxane.

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Abstract

The invention relates to a light-cured resin for 3D (Three-dimensional) printing, which is prepared from the components in percentage by mass: 50 to 80 percent of epoxy resin, 5 to 20 percent of acrylic ester prepolymer, 10 to 40 percent of reactive diluent, 1 to 6 percent of photoinitiator, and 2 to 15 percent of filler. The filler is rigid polysiloxane, and a cage structure of the rigid polysiloxane is used as a framework or a support, so that the volume shrinkage of a material is reduced; an acrylic acid group is arranged on a side group, can be uniformly dispersed into a matrix resin, andhas good compatibility with the resin, so that a mechanical property is improved, and the problem that the shrinkage of the common inorganic filler can be reduced but the mechanical property is also reduced due to low inorganic-organic compatibility is solved.

Description

technical field [0001] The invention relates to the technical field of photocurable resins, in particular to a 3D printing photocurable resin. technical background [0002] 3D printing technology, also known as additive manufacturing technology, is a technology for manufacturing three-dimensional products by adding materials layer by layer through 3D printing equipment based on the designed 3D model. 3D printing integrates cutting-edge technologies in many fields such as digital modeling technology, electromechanical control technology, information technology, material science and chemistry. It is a kind of rapid prototyping technology and is known as the core technology of the "third industrial revolution". Due to the change of the internal molecular structure of the photo-curable resin during the curing process, curing shrinkage occurs, which leads to deformation of the parts and affects the accuracy. Therefore, the development of a resin with low shrinkage during curing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08L83/04C08F283/10C08F222/14B33Y70/00
CPCC08F283/10C08L51/08B33Y70/00C08L83/04C08F222/103C08F222/102
Inventor 段玉岗康小青
Owner XI AN JIAOTONG UNIV
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