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A tube shell structure for box packaging optical devices

A tube case and device technology, applied in the field of optical modules, can solve the problems of easy desoldering and failure of FPC of flexible circuit boards, and achieve the effect of simplifying the tube case production process, simple structure and improving device reliability.

Active Publication Date: 2020-03-10
WUHAN TELECOMM DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is the problem that the existing box packaging form integrated optical device flexible circuit board FPC is easy to desolder and cause failure

Method used

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  • A tube shell structure for box packaging optical devices
  • A tube shell structure for box packaging optical devices
  • A tube shell structure for box packaging optical devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Embodiment 1 of the present invention provides a package structure for box packaging optical devices, such as figure 2 As shown, it includes a metal shell 201, a ceramic part 202 and a conductive pin 203, specifically:

[0041] The conductive pin 203 is buried inside the ceramic part 202 to realize the electrical connection between the inside and the outside of the shell; wherein, one end of the conductive pin 203 located inside the metal shell 201 is made into a gold wire bonding pad, and the conductive pin 203 is made into a gold wire bonding pad. One end of the contact pin 203 located outside the metal shell 201 is made into an FPC pad.

[0042] Wherein, the positions between the conductive pins 203 and the through holes in the ceramic part 202 and between the metal shell 201 and the ceramic part 202 may be positioned by brazing process.

[0043] Among them, between the above-mentioned conductive pin 203 and the through hole in the ceramic part 202, and between the m...

Embodiment 2

[0053] Figure 6 Shown is a schematic diagram of the installation of the existing ceramic shell, FPC and module PCB board. Figure 6 Indicated by the dotted line frame area marked 501 in ), there are through holes processed on each pad of the FPC. Before welding, it is necessary to drag and solder the pads of the FPC and the shell, and then align the FPC with the shell for pressure welding. , After the welding process is completed, judge whether there are any bad phenomena such as missing soldering and virtual soldering on each pad by observing the tin penetration in the through hole. In order to avoid the short circuit and virtual soldering caused by the misalignment of the soft tape pad and the shell pad, the FPC and the shell need to be accurately aligned under a microscope, which leads to a long time for the process; The area of ​​a single pad is small, and the welding strength of the edge pad is poor. When the soft tape is reshaped during the module welding process, the ...

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Abstract

The invention relates to the technical field of optical modules and provides a tubular structure for a box packaging optical device. The tubular structure comprises a metal housing 201, a ceramic member 202, and a conductive pin 203. Specifically, the conductive pin 203 is embedded in the ceramic member 202 to achieve the electrical connection between the interior and the exterior of the tubular structure. The end, located inside the metal housing 201, of the conductive pin 203 is made into a gold wire bonding pad. The end, located outside the metal housing 201, of the conductive pin 203 is made into an FPC bonding pad. The conductive pin 203 and a through hole in the ceramic member 202 are positioned by a brazing technique and the metal housing 201 and ceramic member 202 are positioned bya brazing technique. The conductive pin is used as a high-frequency signal transmission line instead of a microstrip line, and the overlap welding between a FPC gold finger and the housing pad is changed to piercing welding so as to simplify the FPC welding process and prevent device failure due to the sealing-off of the FPC and housing bonding pad, thereby improving device reliability.

Description

【Technical field】 [0001] The invention relates to the technical field of optical modules, in particular to a tube shell structure for box-encapsulated optical devices. 【Background technique】 [0002] At present, high-speed optical devices used for medium and long-distance transmission must adopt the form of BOX hermetic packaging in order to meet the long-term service life requirements of the device. figure 1 Shown is an example of a typical integrated optical receiver structure. The DC signal line and the AC signal line are respectively designed on two layers of flexible circuit boards (Flexible Printed Circuit, abbreviated as: FPC) 102, and the external PCB board passes through the FPC 102, ceramic tube The internal multi-layer wiring of the shell 101 and the bonding gold wire form an electrical connection with the internal integrated amplifier circuit (Trans-Impedance Amplifier, abbreviated as: TIA) 1011 and detector (PhotoDiode, abbreviated as: PD) 1012 . [0003] In th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/4245G02B6/4279G02B6/4281
Inventor 邓磊宋旭宇陈土泉
Owner WUHAN TELECOMM DEVICES