111 results about "Integrated amplifier" patented technology

A measurement system is provided that includes a probe device having an integrated amplifier. The integrated amplifier may be a transimpedence amplifier that amplifies input current to an output voltage.

Prior art architectures of power amplifiers employ a substantial die area, and utilize multiple integrated circuit technologies with a net higher manufacturing cost and large associated packaging area. A new scheme is presented wherein several sense and control signals are used to provide fine and gross control over the key figures of merit associated with integrated semiconductor power amplifiers. How and where these sense and control signals are used is crucial to achieving the most manufacturable and most economic integrated amplifier. In accordance with a first embodiment of the invention, a Dual Feedback-Low power regulation circuit for a three-stage power amplifier integrated circuit is provided. In accordance with a second embodiment of the invention, a current source feedback circuit having low RF output signal power regulation for a three-stage power amplifier integrated circuit is provided. In accordance with a third embodiment of the invention, a detector circuit in the form of an integrated logarithmic current detector circuit in conjunction with a three stage power amplifier integrated circuit. The three embodiments of the invention advantageously overcome the limitations of the prior art.

An electric field sensor includes one or more sensing electrodes connected to an integrated amplifier that bootstraps all parasitic capacitances at the sensor input to provide for a very high input impedance without the need for neutralization or other adjustments and calibration. The integrated amplifier for the electric field sensor further includes low-noise ESD/biasing structures to stabilize the DC-potential of the sensor with a minimum amount of added noise, leakage and parasitic capacitance.

Methods and systems for a DC offset correction loop for a mobile digital cellular television environment are disclosed. Aspects of one method may include removing at least a portion of a DC offset from output of an amplifier. The DC offset may be removed from a single stage amplifier, or from each stage of a N stage amplifier, where N may be an integer. The DC offset may be removed by using second differential signals generated from first differential signals, where the second differential signals may be communicated to inputs of the amplifier. The first differential signals may by a first circuit that integrates outputs of the amplifier. The first circuit may perform the integration using a variable corner frequency that may be adjusted by changing a resistance of at least one variable resistor in the first circuit.

An electrically tunable radio frequency (RF) amplifier includes a resonant circuit having a voltage variable capacitance as one of its elements. In one approach, a drain diffusion capacitance of one of the transistors within the amplifier is used as the voltage variable capacitance. A voltage adjustment unit is provided to adjust a bias voltage on the voltage variable capacitance to change the capacitance value thereof and thus modify the operating frequency range of the amplifier. In one embodiment, the voltage adjustment unit also provides a power supply noise blocking function.

The system and method of integrated seed and high power pump source generates two wavelengths outside the effective gain bandwidth of a single gain medium without using two unique pump sources in a fiber amplifier train. The system and method uses a single pump power oscillator that passes a seed wavelength with no loss and minimal amplification to pump integrated amplifiers in both directions (forward and backward) resulting in amplification of the seed wavelength.

The invention discloses a low-temperature infrared detector feeble current amplifier by differential input. The amplifier adopts a folded common-source and common-gate structure by differential input; a 41MOhm feedback resistor is integrated in a chip; a four-path integrated amplifier chip has the specification of only 3mmx1.9mm; the amplifier can directly convert a current signal of the infrared detector into a voltage signal and can normally operate at the normal temperature of 300 K and low temperature of 77 K; the amplifier can be not only used for amplifying an infrared detector signal but also used for amplifying a visible light detector signal; the 3dB bandwidth of the amplifier is 5KHz under the low temperature of 77K; the equivalent input current noise is 0.025PA/HZ<1/2> at 1KHz; and the minimal unit power can be lowered to 0.32mW.

The present invention discloses a switching amplifier and its modulations process, which belongs to the field of non-filters-type switching amplifier. The switching amplifier comprises; pulse-width modulation with dual comparator, multiple-loop feedback structure, only one integrating amplifier with dual-ends output needed for each loop, no less than two feedback loops set between the integrating amplifier and H-bridge, in addition, no any low-pass filters needed adding to the feedback path. Multiple feedback loops are adopted in the present invention, which can low the distortion of the switching amplifier to the extent. Furthermore, no any extra low-pass filters are needed adding to the feedback path, which making the products a higher cost effectiveness.

Systems, methods and instrumentalities are disclosed for Doherty amplifier optimization. Amplifier configurability and control therefore may be integrated. Amplitude alignment, phase alignment, amplifier gate biasing, driver gate biasing and temperature compensation for N paths in Doherty configurations may be integrated, for example, using a programmable LUT storing control bit patterns. Configurability may comprise reconfigurability between asymmetric power split ratios, between symmetric and asymmetric relationships and between classic and inverted phase relationships, permitting path reconfigurability for higher or lower power and leading or lagging phase. Multiple versions providing more or less configurability and/or control range with more or less insertion loss, such as design and production versions, may be pin compatible, e.g., to reduce time and expense for R&D and production transition. Integration of configurability and/or control may reduce complexity in design, development, control, optimization, production and application, e.g., by eliminating interfaces, mismatches or excessive capacitance between discrete chips.

The invention discloses a cup which comprises a cup body, a cup cover and a base. A sealing ring is arranged in the cup cover, the cup body is composed of three layers, a circulation space is formed between the inner first layer and the middle second layer, openings with plugs are formed in the upper portion and the lower portion of the circulation space respectively, a vacuum heat preservation layer is formed between the middle second layer and the outer third layer, a heating device is installed inside the base of the cup, and a conducting piece is connected with the heating device and located in the cup body. A power source connected with the heating device is further contained in the base and connected with a solar cell panel located on the outer surface of the cup body. The cup further comprises a temperature sensor arranged on the bottom of the cup body, an integrated amplifier arranged in the base, and a temperature displayer arranged on the surface of the base, wherein the temperature sensor, the integrated amplifier and the temperature displayer are all connected with the power source. According to the cup, water can be cooled to reach the drinkable temperature in a short time, time is saved, the water can be kept in the constant temperature state for a long time, sealing performance is good, and carrying is convenient.

Embodiments of the proposed invention preferably provide systems and methods for an improved aftermarket automobile audio amplifier that is easy to install while integrating and improving OEM functionality. Embodiments of the invention preferably directly connect to preexisting OEM wiring and hardware. Embodiments of the invention preferably preserve OEM system functionality and allow for integration of additional auxiliary inputs. A digital signal processing module preferably adjusts an output volume to ensure that auxiliary inputs are audible to a vehicle occupant at an appropriate and comfortable volume level. Therefore, vehicle OEM safety chimes or third party navigational commands may be output to a vehicle occupant at an appropriate volume level irrespective of the presence, absence or volume level of other audio signal outputs. Furthermore, the direct connection to preexisting OEM wiring and hardware preferably allows for both easy installation and easy removal of embodiments of the current invention.

A particle sensor for exhaust system is provided. In one embodiment, the particle sensor comprises a sensor element and an integrated amplifier circuit for amplifying a reference voltage for the sensor element. In this way, the particle sensor may provide increased sensitivity.

An integrated amplifier may include a transconductance stage including a differential pair of input transistors of a first type of conductivity, respective resistive loads coupled to said input transistors, and a first bias circuit coupled to the input transistors. The first bias circuit may include a second differential pair of bias transistors having first conduction terminals coupled in common and second conduction terminals coupled to respective conduction terminals of the input transistors. The first bias circuit may also include respective second bias circuits coupled to the bias transistors to enable the input transistors in a conduction state with the input transistors being biased by a same respective bias current that flows through the respective input transistors. The first bias circuit may also include a capacitive network coupled to the bias transistors to define with the input transistors a feedback loop.

The invention discloses a flip chip interconnection process method for high frequency chip waveguide package, which belongs to the field of microelectronic device interconnection package. The method is based on a flip chip welding technology. In a chip or interconnection ground slide flip chip welding manner, and through a matched corresponding MEMS micro-machining technology, metal interconnection of waveguide package of a high frequency solid-state integrated amplifier module is realized. The bridging distance of chip interconnection can be shortened. The method is free of a pin structure, has the advantages of low parasitic effect, small bonding size and great coherent parameter controllability, and can be used for low loss metal interconnection of waveguide package of the high frequency band/terahertz band solid-state integrated amplifier module.

The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier (202), allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) pakcaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.

The invention discloses a surface acoustic wave resonant pressure sensor, which comprises two resonators, two low-noise singlechip integrated amplifiers, a double balanced mixer and an LC low pass filter. The two resonators are respectively connected to feedback circuits of the amplifiers to form a oscillator wither certain output frequency; and two paths of output frequency are subjected to mixing, lowpass filtering and amplification to obtain difference frequency output corresponding to external applied pressure one to one. The surface acoustic wave resonant pressure sensor can automatically measure medium pressure, overcome the defects of low accuracy, poor reliability and low stability in the prior art, and has the miniaturization and digital measurement function.

A battery simulation circuit simulates a rechargeable battery. The battery simulation circuit includes an integrated amplifier, a voltage adjustment unit, a current limitation unit, and a feedback unit. The voltage adjustment unit provides a reference voltage for the integrated amplifier; the current limitation unit provides a reference current for the integrated amplifier and the feedback unit provides a negative feedback signal for the integrated amplifier to control the integrated amplifier working in a linear state. The integrated amplifier outputs an output signal according to the reference voltage and the reference current; the battery simulation circuit supplies power for an electronic device. When the output terminal is connected to a DC power source and a voltage of the DC power source is greater than the output voltage of the output terminal, the battery simulation circuit simulates a battery being recharged by the DC power source via the output terminal.

The invention discloses a pressure closed loop control digital integrated direct acting type proportional overflow valve, which comprises a valve body, a proportional electromagnet, a pressure sensor and a pressure closed loop control digital integrated amplifier, wherein the proportional electromagnet and the pressure sensor are respectively arranged at the left side and the right side of the valve body, the pressure closed loop control digital integrated amplifier is connected with the pressure sensor through a signal conducting wire, the front end of the proportional electromagnet is provided with a push rod, the push rod acts on a valve core, a reset spring is arranged between the valve core and a valve seat, the valve core and the reset spring are respectively arranged in a guide sleeve, the guide sleeve is arranged on the valve seat and is matched with the valve core, a front end hole of the valve seat is communicated with the pressure sensor, the bottom of the valve body is provided with a pressure oil opening and an oil return opening, the pressure oil opening is communicated with the front end hole of the valve seat, and the oil return opening is respectively communicated with the rest spring and an oil passage arranged in the proportional electromagnet. Therefore the work of the pressure closed loop control digital integrated direct acting type proportional overflow valve is stable, the sensitivity is high, the hysteresis is little, the dynamic quality is high, the reliability is high, the reset spring achieves the protection effect, and the valve unloading pressure at the zero signal current can be reduced.

The invention discloses a microwave integrated amplifier circuit and a manufacturing method thereof. The microwave integrated amplifier circuit comprises a gallium nitride high electron mobility transistor and an oscillation stabilizing circuit connected with the gallium nitride high electron mobility transistor. The gallium nitride high electron mobility transistor and the oscillation stabilizing circuit share the same substrate and the same epitaxy structure on the substrate, and the gallium nitride high electron mobility transistor and the oscillation stabilizing circuit are isolated through an isolating area in the epitaxy structure. The designing and manufacturing of resistors and capacitors in the oscillation stabilizing circuit are compatible with process of the gallium nitride high electron mobility transistor, so that the resistors and the capacitors of the oscillation stabilizing circuit and the gallium nitride high electron mobility transistor can be formed simultaneously. Thus, the manufacturing complexity is reduced, and the cost is saved. In addition, the stability of the amplifier circuit is improved, and an oscillation restraining function is achieved. Furthermore, the size and the cost of the amplifier circuit can be reduced, and the designing difficulty of a follow-up microwave match circuit can be reduced. In addition, the effects of lead inductance can be avoided, and the performance of the gain of the amplifier can be improved.

An waveguide apparatus and associated method are provided. Included is a waveguide and an integrated circuit positioned, at least in part, in the waveguide. The integrated circuit includes an amplifier and at least one transition between the amplifier and the waveguide.