Multi-die higher-order photonic switching structure based on high-density memory

Abstract

The invention provides a multi-die higher-order photonic switching structure based on a high-density memory in order to solve the problem of limited structure of a switching chip due to the bandwidthbottleneck of the memory of the conventional photonic switching structure. The structure is formed by mutual connection of K completely same photonic switching dies based on the high-density memoriesthrough an inter-chip interconnection network and includes N input / output ports, and each photonic switching die comprises N / K input ports, N / K electro-optical conversion modules, N / K separators, a storage input photonic switching network, an optical waveguide, a storage input buffer, a memory control logic, an inter-chip interconnection input output agent module, an inter-chip input buffer, an alternative selector, the high-density memory, a storage output buffer, a storage output photonic switching network, N / K photoelectric conversion modules, and N / K output ports, wherein K, N and k are all integers, 1<=k<=K, and K<=N. According to the structure, the complexity of the switching structure and the cost of optical devices are substantially reduced, and the order of the switching structureis further extended.

Description

technical field [0001] The invention belongs to the field of high-performance computer system interconnection network, in particular to the high-order optical switching structure applied to the high-performance computer interconnection subsystem. Background technique [0002] With the running requirements of big data analysis, machine learning, large-scale commercial application optimization and other applications in High Performance Computing (HPC) systems, an interconnection network for efficient communication of distributed computing core storage resources should be constructed in HPC systems The system becomes a priority. The increase in demand for high-performance computer interconnection and communication has put forward higher requirements for the order and communication capabilities of high-end switching chips. Because high-end switching chips can reduce the network diameter while providing high bandwidth and rich routing paths, they have gradually replaced low-end ...

AI Technical Summary

Problems solved by technology

However, in the high-performance computing-oriented interconnection network switching chip, it is often required that the switching chip has a higher order number of 128 or even 256. Therefore, the single-die optical switching structure based on high-density memory of the patent application Chip design cannot meet the actual needs of high-order switching

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