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Atmospheric-pressure preparation method of silicon dioxide aerogel heat-insulating board

A technology of silica and airgel, which is applied to ceramic products, applications, household appliances, etc., can solve the problems of falling powder and slag, and poor heat insulation of airgel heat insulation boards, so as to achieve small consumption and eliminate Powder slag phenomenon, the effect of uniform pore distribution

Active Publication Date: 2018-06-05
LESHAN VOCATIONAL & TECHN COLLEGE +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a normal-pressure preparation method of silica airgel insulation board, which solves the problem of airgel insulation board prepared by the existing normal-pressure drying method by improving the preparation process of airgel. The heat insulation of the hot plate is poor, and it is prone to powder and slag problems

Method used

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  • Atmospheric-pressure preparation method of silicon dioxide aerogel heat-insulating board

Examples

Experimental program
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Effect test

Embodiment 1

[0052] Such as figure 1 Shown, a kind of atmospheric pressure preparation method of silica airgel insulation board, comprises the following steps:

[0053] 1), the preparation of airgel:

[0054] A), resin treatment: put phenolic resin into ethanol solvent (mass concentration 95%) and fully dissolve at 50 ℃, the molar ratio of phenolic resin and ethanol solvent is 1:8;

[0055] B), preparation of sol: quickly mix ethyl orthosilicate and ethanol (mass concentration 95%) in a molar ratio of 1:15, stir at 800rpm / min for 3min to form a mixed solution, and then immediately add urea (orthosilicate The molar ratio of ethyl ester to urea is 1:0.6), stirred at 35°C and 800rpm / min for 30min to make a sol;

[0056] C), preparation of mixed gel: the phenolic resin and surfactant (KH570) processed through step A) are added in the sol prepared through step B) according to a certain mass ratio and fully mixed, the mass ratio of phenolic resin, KH570 and sol 1:0.05:20 to form a mixed sol o...

Embodiment 2

[0060] Such as figure 1 Shown, a kind of atmospheric pressure preparation method of silica airgel insulation board, comprises the following steps:

[0061] 1), the preparation of airgel:

[0062] A), resin treatment: put alkyd resin into methanol solvent (mass concentration 95%) and fully dissolve at 60°C, the molar ratio of alkyd resin to methanol solvent is 1:10;

[0063] B), preparation of sol: quickly mix methyl orthosilicate and methanol (mass concentration 95%) solution at a molar ratio of 1:18, stir at 1000rpm / min for 4min to form a mixed solution, then immediately add urea (orthosilicate The molar ratio of methyl ester to urea is 1:0.8), stirred at 40°C and 1000rpm / min for 40min to make a sol;

[0064] C), preparation of mixed gel: the alkyd resin and surfactant (KH570) processed through step A) are added in the sol prepared through step B) according to a certain mass ratio and fully mixed, the alkyd resin, KH570 and sol The mass ratio is 1:0.06:20 to form a mixed s...

Embodiment 3

[0068] Such as figure 1 Shown, a kind of atmospheric pressure preparation method of silica airgel insulation board, comprises the following steps:

[0069] 1), the preparation of airgel:

[0070] A), resin treatment: put epoxy resin into methanol solvent (mass concentration 95%) and fully dissolve at 60°C, the molar ratio of alkyd resin to methanol solvent is 1:6;

[0071] B), sol preparation: quickly mix methyltrimethoxysilane and methanol (mass concentration 95%) solution at a molar ratio of 1:20, stir at 1000rpm / min for 5min to form a mixed solution, then immediately add urea (orthosilicon The molar ratio of methyl ester to urea is 1:0.5), stirred at 45°C and 1200rpm / min for 55min to make a sol;

[0072] C), preparation of mixed gel: the epoxy resin, surfactant (KH570) processed through step A) will be added in the sol prepared through step B) according to a certain mass ratio and fully mixed, the epoxy resin, KH570 and sol The mass ratio is 1:0.07:20 to form a mixed sol...

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Abstract

The invention discloses an atmospheric-pressure preparation method of a silicon dioxide aerogel heat-insulating board. The atmospheric-pressure preparation method comprises the following steps: 1), preparing aerogel: A), treating resin: fully dissolving the resin by immersing into an alcohol solvent; B), preparing sol: mixing a raw material and the alcohol solvent, stirring to form a mixed solution, then adding an alkali catalyst, and stirring to obtain the sol; C), preparing mixed gel: adding the resin and a surfactant into the sol according to a certain mass ratio, and uniformly mixing to form mixed sol; 2), immersing pretreated fiber into the mixed sol, performing ultrasonic treatment, and then standing for a period of time in a sealed manner to form gel to obtain a fiber board; and 3),sequentially performing aging, modification, solvent replacement and atmospheric-pressure drying on the fiber board to obtain an aerogel heat-insulating board product I. By the atmospheric-pressure preparation method, through improvement on the preparation technology of the aerogel, the problems that an aerogel heat-insulating board prepared by the conventional atmospheric-pressure drying methodis relatively poor in heat-insulating property and powder and dregs easily shed off are solved.

Description

technical field [0001] The invention relates to the technical field of airgel glass preparation, in particular to a normal-pressure preparation method of a silica airgel heat insulation board. Background technique [0002] Silicon dioxide (SiO 2 ) Airgel is a new type of high-efficiency thermal insulation material, which has the characteristics of extremely low density, extremely high porosity, ultra-low thermal conductivity, sound insulation, and flame retardancy. It is used in aerospace, petrochemical, and building energy conservation , New energy and other fields have broad application prospects, and are listed as one of the top ten new materials in the 21st century. However, due to its poor mechanical properties, brittleness and high production cost, its application has been limited, and it is difficult to achieve large-scale industrial production. Therefore, airgel needs to be reinforced and composited with other materials such as ceramics and fibers to better meet th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B30/02C04B38/00
CPCC04B30/02C04B2201/20C04B2201/32C04B14/064C04B14/46C04B14/42
Inventor 胡小冬姜希猛崔明现
Owner LESHAN VOCATIONAL & TECHN COLLEGE
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