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A bending-resistant backplane

An anti-bending, backplane technology, applied in metal material coating process, vacuum evaporation plating, coating and other directions, can solve the problem of short life of backplane

Active Publication Date: 2020-06-05
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the lifetime of existing backplanes is still relatively short

Method used

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  • A bending-resistant backplane
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  • A bending-resistant backplane

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Experimental program
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Effect test

Embodiment Construction

[0026] As mentioned in the background art, there are many problems in the backplane, for example, the lifespan of the backplane is short because the backplane is easily bent and deformed.

[0027] Combining with a backplane, analyze the reasons for the short service life of the backplane:

[0028] figure 1 It is a structural schematic diagram of a backplane.

[0029] Please refer to figure 1 , the back plate includes: a bottom plate 100, the bottom plate 100 includes an opposite welding surface and a back surface, and the welding surface is used for welding a target; a cover plate 101; located between the cover plate 101 and the back surface of the bottom plate 100 a sealing ring 102; a fixing portion 120 for fixing the back plate 101 and the bottom plate 100;

[0030] The sealing ring 102 , the bottom plate 100 and the cover plate 101 enclose a closed space 110 . During the use of the backing plate, in order to reduce the temperature of the backing plate and the target ma...

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Abstract

The invention provides an anti-bending back plate. The anti-bending back plate comprises a bottom plate, the bottom plate comprises a welding face and a back face, the bottom plate comprises a weldingarea, a stress area surrounding the welding area, an additionally-arranged part located on the welding face of a part of the stress area of the bottom plate and a cover plate located on the back faceof the bottom plate. The welding face of the stress area of the bottom plate is provided with the additionally-arranged part, the additionally-arranged part can bear certain external force, the section inertia moment of the bottom plate is increased, and the bending deformation amount generated by the bottom plate when bearing stress can be reduced. Therefore, the back plate has a long service life.

Description

technical field [0001] The invention relates to the field of target material preparation, in particular to an anti-bending back plate. Background technique [0002] The target refers to the sputtering source that forms various functional thin films by sputtering coating method. Simply put, the target is the target material bombarded by high-speed energetic particles. In order to ensure that the target has good electrical and thermal conductivity, the target needs to be welded to the back plate (copper or aluminum, etc.) before sputtering to form a target assembly. The target is installed on the machine table through the back plate. [0003] During the vacuum sputtering process, the environment of the target assembly is very harsh. Its temperature is relatively high (such as 300 ℃ ~ 500 ℃), the target component is in a high-voltage electric field and a strong magnetic field, and the front is at 10 -9 In the high-vacuum environment of Pa, the target is bombarded by high-en...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34
CPCC23C14/3407
Inventor 姚力军潘杰相原俊夫王学泽韩范虹
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD