Method for removing surface pollution of polished silicon wafer with normal-temperature HF acid
A silicon wafer surface, room temperature technology, applied in the direction of using liquid cleaning methods, cleaning methods and utensils, chemical instruments and methods, etc., to achieve the effect of being conducive to cleaning, moderating the reaction, and enhancing the cleaning effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0025] The present invention will be further described below in conjunction with the drawings.
[0026] The specific method introduced by the present invention is as follows:
[0027] 1. Chemical reagent: 49%-51% hydrofluoric acid stock solution, surface active reagent (English abbreviation TSC-1) is added to the cleaning tank in a certain proportion.
[0028] 2. Two tanks are added in front of the traditional standard cleaning and washing machine, namely the chemical tank made of Teflon and the pure water tank made of quartz.
[0029] 3. Mixing of stock solution: 49% of the hydrofluoric acid stock solution is weighed according to the ratio of 0.8% to 1.2% of the volume of the liquid tank body and the stock solution is weighed in the weighing tank; the surfactant (English abbreviation TSC-1) is in accordance with the tank Weigh the stock solution at a ratio of 0.1-0.2% of the body volume and place it in a weighing barrel.
[0030] 4. Mix the two solutions and put them in a Teflon liqui...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap