A three-dimensional integrated packaging of millimeter-wave antenna and silicon-based components

Abstract

The invention discloses a three-dimensional integrated package based on a millimeter-wave antenna and a silicon-based multi-channel component, including a top-layer radiation microstrip patch antenna array, a high-resistivity silicon substrate with a TSV feeding structure, microwave wiring and digital The dielectric wiring layer of the wiring, the frame with the TSV three-dimensional vertical transmission structure, and the airtight packaging cover with the TSV transmission structure. The invention simultaneously integrates the microstrip patch antenna array, microwave chip, digital chip and passive device in the same module through MEMS technology, and the middle part of the surrounding frame has a TSV structure for vertical transmission of microwave signals, which has a high degree of integration and microwave Excellent performance enables multifunctionality and miniaturization of components.

Description

technical field [0001] The invention relates to a three-dimensional integration technology of a millimeter-wave antenna and a silicon-based multi-channel component, in particular to a three-dimensional integrated packaging of a millimeter-wave antenna and a silicon-based component. Background technique [0002] At present, the trend of radio frequency components is developing in the direction of miniaturization, light weight, array, and low power consumption. Traditional radio frequency components adopt LTCC + micro-assembly process, PCB board process + micro-assembly process, and the chips are interconnected through gold wire planes, and are packaged in a hermetic package. With the rise of MEMS technology, the design idea of ​​radio frequency components began to consider the use of Si substrates instead of traditional microwave dielectric ceramic substrates and PCB boards. Small loss and short delay. [0003] The traditional integration of antennas and components adopts m...

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Problems solved by technology

[0004] It can be seen from the above that the existing technology has the following problems: the RF front-end module of the antenna and components that can realize the millimeter wave operating frequency is relatively large, the microwave loss is serious, and the packaging method is backward, which cannot meet the requirements of miniaturization and low cost.

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