A three-dimensional integrated packaging of millimeter-wave antenna and silicon-based components
A millimeter-wave antenna and integrated packaging technology is applied in the field of three-dimensional integration of millimeter-wave antennas and silicon-based multi-channel components, which can solve the problems of backward packaging methods, inability to meet miniaturization and low cost, and serious microwave loss, and achieve high integration. Effect
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[0033] Such as figure 1 , figure 2 A three-dimensional integrated package of a novel millimeter-wave antenna and a silicon-based multi-channel component is shown. Its design architecture includes a microstrip patch antenna array, a high-resistivity silicon substrate, a BCB medium with large-scale multilayer wiring, a frame with a TSV structure, and a double-sided patterned cover.
[0034] The millimeter-wave microstrip patch antenna array is composed of 2×2 high-bandwidth, high-gain radiating elements, and its feeder is connected to the single-channel output of the component by four 3D vertically transmitted TSVs. By optimizing the three-dimensional structure and feeding network of the new radiating unit, the high gain and high bandwidth of the millimeter-wave array antenna are realized. The TSV inside the high-resistivity silicon substrate has an aspect ratio of 10:1 and is filled with metal Cu. The dielectric on the bottom surface of the high-resistivity silicon substrat...
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