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Sheet for heat joining and sheet for heat joining with dicing tape

A technology for cutting tapes and sheets, used in conductive adhesives, inorganic adhesives, films/sheets without carriers, etc.

Active Publication Date: 2018-06-15
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Semiconductor devices for applications with harsh thermal environments are assumed to operate at high temperatures of around 250°C. Conventional solders and conductive adhesives used as bonding / adhesive materials have thermal characteristics and reliability problems.

Method used

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  • Sheet for heat joining and sheet for heat joining with dicing tape
  • Sheet for heat joining and sheet for heat joining with dicing tape
  • Sheet for heat joining and sheet for heat joining with dicing tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0167] Hereinafter, the present invention will be described in detail using examples, but the present invention is not limited to the following examples unless the gist of the present invention is exceeded.

[0168] Components used in Examples will be described.

[0169] Copper microparticles A: Copper microparticles with an average particle diameter of 200 nm and an average diameter of crystallites of 31 nm produced by Mitsui Metal Mining Co., Ltd.

[0170] Paste A containing metal particles: suitable for adjusting the concentration of the low-boiling-point binder contained in ANP-1 (a paste in which nano-sized silver particles are dispersed in a low-boiling-point binder) produced by Applied Nanoparticles Research Institute. Those who get by quantity.

[0171] Pyrolytic binder A (polypropylene carbonate resin): QPAC40 manufactured by Empower, solid at 23°C

[0172] Pyrolytic binder B (acrylic resin): MM-2002-1 manufactured by Fujikura Kasei Co., Ltd., solid at 23°C

[0173...

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PUM

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Abstract

There is provided a sheet for heat joining having a layer with average area of a pore portion at a cross section in a range of 0.005 mum to 0.5 mum after increasing a temperature from 80 DEG C to 300DEG C at temperature rise rate of 1.5 DEG / sec. under pressure of 10 MPa and holding at 300 DEG C for 2.5 min.

Description

technical field [0001] The present invention relates to a sheet for heat bonding and a sheet for heat bonding with a dicing tape. Background technique [0002] In the manufacture of semiconductor devices, the method of bonding semiconductor elements to adherends such as metal lead frames (so-called die bonding method) has changed from the conventional gold-silicon eutectic method to the method of using solder and resin paste. Currently, conductive resin pastes are sometimes used. [0003] In recent years, the spread of power semiconductor devices that control and supply electric power has become remarkable. Current always flows through power semiconductor devices, so they generate a lot of heat. Therefore, a conductive adhesive that can be used for a power semiconductor device desirably has high heat dissipation and low resistivity. [0004] Power semiconductor devices are required to operate at high speed with low loss. Conventionally, semiconductors using Si such as IG...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/52H01L21/60C09J1/00C09J7/00C09J201/00H01L21/301C09J7/10C09J7/24C09J7/25C09J7/26C09J7/28
CPCH01L24/27H01L2224/83191C09J7/10H01L23/3121H01L2221/68327H01L2221/68377H01L2924/13055H01L2224/29239H01L2224/29247H01L24/29H01L24/45H01L24/83H01L24/85H01L2224/29339H01L2224/29347H01L2224/29386H01L2224/32145H01L2224/32245H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/48227H01L2224/48247H01L2224/83203H01L2224/8384H01L2224/85205H01L2924/10253H01L2924/10272H01L2924/1033H01L2924/13091H01L2224/29286H01L24/05C09J9/02H01L2224/48091H01L2224/73265H01L2924/181H01L24/48H01L24/73H01L2224/32225C09J2203/326C08K2003/0806C08K2003/085C08K2003/2286C08K2003/2248C08K2201/001H01L21/6836H01L2224/2929H01L2224/05639H01L2224/05166H01L2224/85447H01L2224/29344C09J2301/41H01L2924/00012H01L2924/00014H01L2924/00H01L2924/0685H01L2924/0541H01L2924/01029H01L2924/01047H01L24/32C09J2469/006C09J7/28C09J7/26C09J7/25C09J7/24C09J2400/163C09J2433/006C09J201/00
Inventor 菅生悠树镰仓菜穗
Owner NITTO DENKO CORP
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