Packaging structure and process method thereof

Abstract

The invention relates to a packaging structure and a process method thereof. The packaging structure comprises a metal circuit, a chip and a bonding wire. The metal circuit is arranged around the chipand comprises an upper structure and a lower structure. The lower structure is columnar. The upper structure is in a shape of mushroom. A photoresist film is pasted on the surface of a carrier, and then is exposed and developed. An area to be electroplated is exposed, then the metal circuit is electroplated, the photoresist film is removed, the chip is mounted, the wire is soldered, and the packaging is achieving. Finally, the carrier is removed and printing and cutting are achieved. The method forms a circuit in a mushroom shape by single film pasting and electroplating, reduces the size ofthe semiconductor packaging structure, and improves the bonding performance between the circuit and the molding compound.

Description

Technical field [0001] The present invention relates to the technical field of semiconductor packaging, in particular to a packaging structure and a process method thereof. Background technique [0002] With the development of electronic products such as mobile phones and notebook computers towards miniaturization, portability, ultra-thinness, multimedia, and low cost to meet the needs of popularization, traditional semiconductor packaging with lead frames as the carrier has a wide variety of types However, traditional lead frames are often unable to further reduce the overall height of the package due to thickness limitations. [0003] Therefore, a semiconductor package structure without a carrier board has been developed. The package structure first electroplates a layer of metal on a carrier board to form an ultra-thin circuit, then sets the chip on the circuit and connects it by wire bonding, and then encapsulates it to form a packaging gel. Finally, the carrier board is remov...

AI Technical Summary

Problems solved by technology

The package structure is ultra-thin than the traditional frame structure, but the metal layer of this structure is thinner, and the solder joints are easy to cause damage to the metal layer when soldering wires

The outer metal layer does not have any support, and is only encapsulated by the plastic encapsulant. If the plastic encapsulant and the metal layer are not well bonded, the metal layer is easy to lift and peel off the plastic encapsulant, which will affect the product yield and reliability.

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