Method for improving deep plating capacity of electrocoppering
A technology of electroplating copper and electroplating copper layers, which is applied in the direction of electrolytic process, electrolytic components, cells, etc., can solve the problems of reduced production capacity, board surface quality problems, waste of resources, etc., and achieve the effect of improving deep plating ability
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[0022] Example 1
[0023] A method for improving the deep plating ability of electroplating copper, including the following steps:
[0024] A. Configure electroplating solution, which includes:
[0025] Copper sulfate 150g / L, sulfuric acid 380g / L, sodium nitrite 6g / L, 3-oxocyclobutanecarboxylic acid 17g / L, manganese disodium ethylenediaminetetraacetate 3g / L, 4-methyl-2 -Sodium oxovalerate 10g / L, brightener 6g / L, smoothing agent 6g / L, modifier 3g / L, the balance is water;
[0026] B. Pour the electroplating solution into the electroplating tank, and put the circuit substrate into the electroplating tank vertically;
[0027] C. Control the temperature of the electroplating solution at 52℃, power on for electroplating, and control the current density at 16A / dm 2 ;
[0028] D. When the thickness of the electroplated copper layer is increased to 55% of the target thickness, the temperature of the electroplating solution is increased to 65°C, and the current density is reduced to 5.5A / dm 2 ;
...
Example Embodiment
[0039] Example 2
[0040] A method for improving the deep plating ability of electroplating copper, including the following steps:
[0041] A. Configure electroplating solution, which includes:
[0042] Copper sulfate 150g / L, sulfuric acid 380g / L, sodium nitrite 6g / L, 3-oxocyclobutanecarboxylic acid 17g / L, manganese disodium ethylenediaminetetraacetate 3g / L, 4-methyl-2 -Sodium oxovalerate 10g / L, brightener 6g / L, smoothing agent 6g / L, modifier 3g / L, the balance is water;
[0043] B. Pour the electroplating solution into the electroplating tank, and put the circuit substrate into the electroplating tank vertically;
[0044] C. Control the temperature of the electroplating solution at 52℃, power on for electroplating, and control the current density at 16A / dm 2 ;
[0045] D. When the thickness of the electroplated copper layer is increased to 55% of the target thickness, the temperature of the electroplating solution is increased to 65°C, and the current density is reduced to 5.5A / dm 2 ; W...
Example Embodiment
[0056] Example 3
[0057] A method for improving the deep plating ability of electroplating copper, including the following steps:
[0058] A. Configure electroplating solution, which includes:
[0059] Copper sulfate 150g / L, sulfuric acid 380g / L, sodium nitrite 6g / L, 3-oxocyclobutanecarboxylic acid 17g / L, manganese disodium ethylenediaminetetraacetate 3g / L, 4-methyl-2 -Sodium oxovalerate 10g / L, brightener 6g / L, smoothing agent 6g / L, modifier 3g / L, and 1-ethyl-3-methylimidazole potassium hexafluorophosphate 6g / L, the rest The amount is water;
[0060] B. Pour the electroplating solution into the electroplating tank, and put the circuit substrate into the electroplating tank vertically;
[0061] C. Control the temperature of the electroplating solution at 52℃, power on for electroplating, and control the current density at 16A / dm 2 ;
[0062] D. When the thickness of the electroplated copper layer is increased to 55% of the target thickness, the temperature of the electroplating solutio...
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