Organic light emitting display device and preparation method thereof

Abstract

The invention relates to an organic light emitting display device and a preparation method thereof. The method comprises the following steps: a low-temperature polysilicon layer and an organic electroluminescent device are formed on a first substrate sequentially, wherein the first substrate is provided with first alignment marks; silk screen is performed on the second substrate for formation of package frit and second alignment marks; the second alignment marks are aligned with the first alignment marks of the first substrate, so that the second substrate is attached to the first substrate; the package frit is sintered by laser, and a package layer for connecting the first substrate with the second substrate is formed. The package frit and the second alignment marks are formed on the second substrate by silk screen, so that the second alignment marks are more convenient to form, the preparation process is reduced, preparation efficiency is improved, the preparation cost is effectivelyreduced, the second substrate is effectively prevented from receiving laser energy repeatedly, and breakage of the second substrate is avoided in the high-temperature process.

Description

technical field [0001] The invention relates to the technical field of organic light-emitting display manufacturing, in particular to an organic light-emitting display device and a preparation method thereof. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) display is considered to be the most potential display device because of its advantages such as self-illumination, ultra-thin, fast response, wide viewing angle, and low power consumption. [0003] In order to ensure the service life of the OLED device, it is usually encapsulated with an encapsulation layer to prevent oxygen and water vapor from entering the OLED device and affecting the performance of the organic light-emitting layer inside the OLED device. [0004] At present, glass powder is generally used as the packaging material for hard-screen OLED devices. Glass powder is filled in the sealing area between the rear cover and the back plate of the OLED device, and the ...

AI Technical Summary

Problems solved by technology

It is produced by photolithography after forming metal film by CVD, which involves PVD, Photo, etching, stripping and other processes. The process is complicated, the cost is high, and there is a certain proportion of etching residue problems.

[0007] The laser etching method is used to make the alignment mark of the package back cover, and laser equipment is required. The price of laser equipment is relatively expensive, and the maintenance cost in the later period is also high.

In addition, the principle of using the laser method to make the alignment mark of the package back cover is to etch the surface or inside of the glass. When the surface etching process is used, micro-dust will be generated. These micro-dust are extremely difficult to clean and will adhere to the cleaning line equipment. In the cleaning line equipment, it will cause cross-contamination, and even pollute the OLED pattern area; while using the internal etching process, the back cover glass is subjected to a high-temperature sintering process of glass powder, and the high-temperature sintering temperature is in the range of 400°C to 500°C. The damage to glass caused by etching will cause a certain proportion of high-temperature sintering fragments, which not only affects the yield rate, but also contaminates other glass in the high-temperature sintering furnace after the fragmentation, and damages the high-temperature sintering furnace

On the other hand, the material of the alignment mark on the traditional back cover is usually metal molybdenum. After the metal molybdenum undergoes a high-temperature process above 480 degrees, it will be oxidized and deteriorated, resulting in poor adhesion to the back cover. Subsequent processes such as ultrasonic and plasma cleaning processes are removed from the back cover

Images