Fabrication method of a buried resistor soft-rigid board

Abstract

The invention relates to a manufacturing method of a resistor buried soft and hard combined board, and belongs to the technical field of circuit board production. When a resistor core plate is manufactured, an internally line is prepared via acidic etching, a copper layer in a windowing position is removed via alkalic etching to form a buried resistor, and damage on a nickel-phosphorous alloy layer and influence on the resistance of the buried resistor can be avoided in the manufacturing process of the internal layer. The windowing size is determined by considering the lateral etching amount of alkalic etching of the buried resistor and the micro etching amount when the resistor core plate is browned, the practical resistance of the buried resistor is measured to adjust the etching speed of alkalic etching of the buried resistor of other buried resistor core plates correspondingly, and the resistance precision of the prepared buried resistor can be improved. A finger position in a softboard area of a soft core plate is pasted with a protective adhesive tape, and formation of black-point adhesive stain is prevented from being formed in the surface of the finger position, and further the finger position is prevented from failure in gold plating when the finger position is electroplated with a golden layer subsequently. Thus, the method can be used to manufacture the soft and hard combined board with high resistance precision of the buried resistor and high gold quality of golden fingers in the internal layer.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a buried resistance soft-rigid board. Background technique [0002] According to the development of the PCB industry, the emergence of hard-bonded boards provides a new connection method for the interconnection between electronic components. With the development of electronic information technology and the trend of people's needs for electronic equipment, light, thin, short and Multifunctional soft and hard board is the trend of future development. The advantages of soft and hard boards are as follows: reduce the assembly size and weight of electronic products, avoid online errors, increase assembly flexibility, improve reliability and realize three-dimensional assembly under different assembly conditions. Inevitable demand. In recent years, the development of soft and hard boards has become more and more fierce. It combines the advan...

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem that the resistance value precision of the buried resistor and the quality of the gold fingers need to be further improved in the existing buried resistance soft-rigid combination board, and provides a method for manufacturing a buried resistance soft-hard combination board with high resistance value precision, and can improve the built-in Manufacturing method of golden finger quality buried resistance soft and hard board

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