Formaldehyde-free artificial board adhesive and preparation method thereof

A technology of man-made and board glue, applied in the direction of adhesives, adhesive types, starch adhesives, etc., can solve the problems of not meeting the production process of wood-based boards, short opening time, etc., achieve low cost, solve the pollution of formaldehyde, The effect of a wide range of raw material sources

Inactive Publication Date: 2018-07-27
东营市盛基环保工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems that water-based isocyanate (EPI) adhesives and soybean protein adhesives have a short opening time and cannot meet the needs of the wood-based panel production process, the present invention selects

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Polyamide polyamine epichlorohydrin (PAE) 60wt%

[0043] Polyvinyl alcohol solution 10wt%

[0044] Wheat flour 29.8wt%

[0045] Defoamer 0.1wt%

[0046] Antiseptic bactericide 0.1wt%.

[0047] First add the formula amount of polyamide polyamine epichlorohydrin (PAE) and polyvinyl alcohol solution into the reaction kettle and stir for 10-15 minutes to make them evenly mixed, then add the formula amount of defoamer and antiseptic and bactericide, and continue stirring for 5 -10 minutes, then slowly add wheat flour while stirring to make the wheat flour fully swell and mix until the appearance is uniform without visible particles, and then continue to stir for 10 minutes.

[0048]The obtained formaldehyde-free wood-based panel adhesive can be opened for two hours, and the class II water-resistant bonding strength can reach 1.22MPa.

Embodiment 2

[0050] Modified polyamide polyamine epichlorohydrin (modified PAE) 47.7wt%

[0051] Polymer emulsion 20wt%

[0052] Inorganic mineral powder filler 15wt%

[0053] Halogen-free inorganic flame retardant 15wt%

[0054] Thickener 2wt%

[0055] Defoamer 0.1wt%

[0056] Antiseptic and fungicide 0.1wt%

[0057] Dispersant 0.1wt%

[0058] First, add the formulated amount of modified polyamide polyamine epichlorohydrin (modified PAE) and polyvinyl alcohol solution into the reaction kettle and stir for 10-15 minutes to make them evenly mixed, then add the formulated amount of defoamer, dispersant and Antiseptic and fungicide, continue to stir for 5-10 minutes, then slowly add inorganic mineral powder filler and halogen-free inorganic flame retardant while stirring, until the appearance is uniform without visible particles, continue to stir for 15 minutes, then add thickener to thicken the adhesive Viscosity adjusted to 10000-30000mPa. s.

[0059] The obtained formaldehyde-free ...

Embodiment 3

[0061] Polyamide polyamine epichlorohydrin (PAE) 60wt%

[0062] Inorganic mineral powder filler 20wt%

[0063] Wood powder 17.8wt%

[0064] Dispersant 0.2wt%.

[0065] First add the formula amount of polyamide polyamine epichlorohydrin (PAE) into the reaction kettle, add the formula amount of dispersant, and continue stirring for 10 minutes; then slowly add wood powder and inorganic mineral powder fillers while stirring, until The appearance is uniform without visible particles, and the stirring is continued for another 15 minutes.

[0066] The obtained formaldehyde-free wood-based panel adhesive can be opened for two hours, and the class II water-resistant bonding strength can reach 1.20 MPa.

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PUM

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Abstract

The invention relates to wood adhesive, in particular to novel formaldehyde-free artificial board adhesive and a preparation method thereof. In order to solve the problem that waterborne polyisocyanate (EPI) adhesive and soybean protein adhesive have short opening time and are unable to meet the needs of the artificial board production process, PAE (polyamide-polyamine-epichlorohydrin) or modifiedPAE is used as a main adhesion material that is subjected to compounding and modification with polyvinyl alcohol solution, polymer emulsion, wheat flour, soybean protein powder, wood powder and the like so as to obtain the formaldehyde-free artificial board adhesive having long opening time.

Description

technical field [0001] The invention relates to a wood adhesive, in particular to a novel formaldehyde-free wood-based panel adhesive and a preparation method thereof, belonging to the field of fine chemicals. Background technique [0002] At present, the adhesives used in the production of wood-based panels are mainly urea-formaldehyde resin adhesives, followed by phenolic resin adhesives and melamine resins. These kinds of adhesives are all formaldehyde series glues. The most prominent problem of using these kinds of adhesives is the release of formaldehyde. Because of the release of formaldehyde during the production of wood-based panels and the use of their products, the so-called formaldehyde is where we usually talk about the "toxicity" of wood-based panels. With the progress of human society, people's awareness of environmental protection and physical health has increased, which has led to concern about the amount of formaldehyde released from wood-based panels, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/06C09J129/04C09J103/02C09J197/02
CPCC09J177/06C08L2205/03C08L2205/16C08L29/04C08L3/02C08L97/02
Inventor 杨奠基石延芳
Owner 东营市盛基环保工程有限公司
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