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Cleaning and sweeping device and method and mechanical arm for cleaning and sweeping wafer

A cleaning device and robotic arm technology, applied in the fields of cleaning devices, robotic arms, and methods, can solve problems such as poor focusing, image defects, and impact on wafer yield, so as to improve production yield, reduce contamination particles, and prevent crossover. Effects of contamination and workmanship defects

Inactive Publication Date: 2018-07-27
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, in the semiconductor coating and development process, the wafer is directly sent to the photolithography machine for exposure after being coated with the coating machine. Particles will adhere to the back of the wafer due to friction and other reasons. These particles may cause cross-contamination of equipment or cause poor focus problems such as defocus during exposure, resulting in image defects. , affecting the yield of wafer production

Method used

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  • Cleaning and sweeping device and method and mechanical arm for cleaning and sweeping wafer
  • Cleaning and sweeping device and method and mechanical arm for cleaning and sweeping wafer
  • Cleaning and sweeping device and method and mechanical arm for cleaning and sweeping wafer

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Embodiment Construction

[0028] The technical solution of the present invention adds a particle cleaning function on the robotic arm (ARM) used to transfer wafers, and purges through high-pressure gas (such as nitrogen), thereby preventing the particles adsorbed on the back of the wafer in the previous process machine from being brought into the The next process machine will cause problems such as cross-contamination of the machine, which improves the production yield. A detailed description will be given below in conjunction with the accompanying drawings and embodiments.

[0029] Please refer to figure 1 The schematic cross-sectional structure of the cleaning device is shown. The cleaning device according to the embodiment of the present invention includes: an adsorption part 10 and a cleaning mechanism; the cleaning mechanism includes a support part 11 , an air inlet 12 and a cleaning hole 13 .

[0030] The adsorption part 10 is used for adsorption under the grasping part of the mechanical arm. T...

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Abstract

The technical scheme of the invention discloses a cleaning and sweeping device and a method and mechanical arm for cleaning and sweeping a wafer. The cleaning and sweeping device comprises sucking parts and a cleaning and sweeping mechanism; the sucking parts are used for being sucked under a grasping part of the mechanical arm; the cleaning and sweeping mechanism includes a support part, air inlets and cleaning and sweeping holes, the support part supports the sucking parts, and the cleaning and sweeping holes are communicated with the air inlets; the cleaning and sweeping holes are used forpurging the back side of an object when the grasping part of the mechanical arm grasps the object. According to the technical scheme, cleaning and sweeping can be achieved in the process of conveyingthe object, not only is excessive cleaning and sweeping time not required to be add, but also pollution particles on the back side of the object can be reduced, cross-contamination between process equipment caused by particulate matter and process defects are prevented, and therefore the production yield of the wafer is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing equipment, and in particular relates to a cleaning device, a method for cleaning a wafer, and a mechanical arm. Background technique [0002] In the existing semiconductor process, the wafer (wafer) undergoes multiple process steps, and inevitably suffers some pollution. For example, in the semiconductor coating and development process, the wafer is directly sent to the photolithography machine for exposure after being coated with the coating machine. Particles will adhere to the back of the wafer due to friction and other reasons. These particles may cause cross-contamination of equipment or cause poor focus problems such as defocus during exposure, resulting in image defects. , affecting the yield of wafer production. [0003] Therefore, how to reduce or remove the particles on the back of the wafer to avoid the above-mentioned defects has become an urgent problem to be sol...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02057H01L21/0209H01L21/67028
Inventor 李敏超黄志凯颜廷彪
Owner HUAIAN IMAGING DEVICE MFGR CORP
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