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Adhesive composition and structure

A composition and adhesive technology, applied in the direction of adhesives, conductive adhesives, structural connections of printed circuits, etc., can solve the problems of low activation energy, difficulty in storage stability near normal temperature, etc. The effect of reducing and excellent storage stability

Active Publication Date: 2018-07-31
株式会社力森诺科
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is known that in order to achieve this low-temperature short-time curing, it is necessary to use a thermal latent catalyst with low activation energy, but it is very difficult to achieve storage stability near room temperature

Method used

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  • Adhesive composition and structure
  • Adhesive composition and structure
  • Adhesive composition and structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0112] Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples. However, the present invention is not limited to the following examples.

[0113] (synthesis of polyurethane)

[0114] In a separable flask equipped with a reflux cooler, a thermometer, and a stirrer, 1000 parts by mass of polypropylene glycol (manufactured by Wako Pure Chemical Industries, Ltd., number-average molecular weight Mn=2000) and 4000 parts by mass of After methyl ethyl ketone (solvent), it stirred at 40 degreeC for 30 minutes, and prepared the reaction liquid. After raising the temperature of the reaction liquid to 70°C, 0.0127 parts by mass of dimethyltin laurate (catalyst) was added. Next, to this reaction liquid, a solution prepared by dissolving 125 parts by mass of 4,4'-diphenylmethane diisocyanate in 125 parts by mass of methyl ethyl ketone was added dropwise over 1 hour. Then, the stirring was continued at the above temperatur...

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PUM

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Abstract

This adhesive composition comprises: a first silane compound having a radical-polymerizable functional group; a second silane compound that reacts with the first silane compound; a radical-polymerizable compound (except for compounds classified as said first silane compound); and a peroxide having a one-minute half-life temperature of 120 DEG C or lower.

Description

technical field [0001] The present invention relates to adhesive compositions and structures. Background technique [0002] Conventionally, in semiconductor elements and liquid crystal display elements (display display elements), various adhesives have been used for the purpose of bonding various members in the element. The characteristics required of adhesives include adhesiveness, heat resistance, reliability under high temperature and high humidity, and many other aspects. In addition, as adherends used for bonding, printed wiring boards, organic substrates (polyimide substrates, etc.), metals (titanium, copper, aluminum, etc.), materials with ITO, IZO, IGZO, SiN x , SiO 2 Substrates with different surface states require molecular design of the adhesive according to each adherend. [0003] Conventionally, thermosetting resins (epoxy resins, acrylic resins, etc.) exhibiting high adhesiveness and high reliability have been used for adhesives for semiconductor elements a...

Claims

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Application Information

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IPC IPC(8): C09J4/00C09J4/02C09J9/02C09J11/00C09J11/06H01B1/22H05K1/14H05K3/32
CPCC09J4/00C09J9/02C09J11/00C09J11/06H01B1/22H05K1/14H05K3/32C09J11/04H05K3/20
Inventor 森尻智树竹田津润田中胜立泽贵工藤直
Owner 株式会社力森诺科