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Piezoelectric array element manufacture method for high-frequency endoscopic ultrasound transducer

An ultrasonic transducer, piezoelectric array element technology, applied in ultrasonic/sonic/infrasonic diagnosis, application, acoustic diagnosis and other directions, can solve the complex production method of piezoelectric array element, transducer assembly difficulty, low yield, etc. problem, to the effect of simplifying the wire connection process and reducing the possibility of poor wire contact

Inactive Publication Date: 2018-08-03
XIDIAN UNIV +1
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AI Technical Summary

Problems solved by technology

However, the traditional piezoelectric array element manufacturing method is complicated, the transducer assembly is difficult and the yield rate is low

Method used

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  • Piezoelectric array element manufacture method for high-frequency endoscopic ultrasound transducer

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Embodiment 1

[0024] A method for manufacturing a piezoelectric array element for high-frequency endoscopic ultrasonic transducers, the piezoelectric single crystal material PMN-PT with electrodes on the upper and lower sides, and epoxy resin doped with silver particles on the upper side as the first For the matching layer, the conductive material E-solder3022 is added on the lower side as the backing layer. Use a diamond knife with a blade width of 0.1mm to cut it into 0.4mm×0.4mm array element blocks on a cutting machine, and the interval between array element blocks is 0.1mm at this time. Fill epoxy into the kerf, and grind off excess epoxy after curing. Turn the piezoelectric element over, add an epoxy resin layer, grind it flat after curing (the thickness of epoxy at the bottom is 0.025mm), cut through the epoxy and slightly cut through the lower surface of the backing layer when cutting the groove. Then turn the piezoelectric array element over, and use a diamond knife with a blade w...

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Abstract

The invention relates to a piezoelectric array element manufacture method for a high-frequency endoscopic ultrasound transducer. The method comprises the steps that an initial array element is cut into discrete array element blocks, cutting gaps among the array element blocks are filled with epoxy resin, the surfaces of matching layers of the array element blocks are covered by the epoxy resin, after the epoxy resin is cured, the surfaces of backing layers of the array element blocks are coated with the epoxy resin to form lower epoxy resin layers, after the lower epoxy resin layers are cured,slotting is carried out on the surfaces of the lower epoxy resin layers, the slot depth of the slotting is greater than the thickness of the lower epoxy resin layers, then cutting is carried out to obtain piezoelectric array elements, and the piezoelectric array elements are the array element blocks of which the outer surface are evenly coated with the epoxy resin. According to the above technical scheme, the piezoelectric array elements covered by the epoxy resin at the periphery and bottom are obtained, the cutting slots are filled with epoxy resin in assembling, guide wires are fixed to reduce the possibility of bad contact of the guide wires, the preparation technology process of the transducer is simplified, and the rate of good products is improved.

Description

technical field [0001] The invention relates to the field of ultrasonic transducers, in particular to a method for manufacturing piezoelectric array elements for high-frequency endoscopic ultrasonic transducers. Background technique [0002] In the field of medical diagnostics, ultrasound transducers are often used to diagnose diseases. Endoscopic ultrasonography (EUS) is a digestive tract inspection technology that combines endoscopy and ultrasound. A miniature high-frequency ultrasound probe is placed on the top of the endoscope. When the endoscope is inserted into the body cavity, the endoscope can directly observe the gastrointestinal mucosal lesions. , Real-time scanning of ultrasound under the endoscope can be used to obtain the histological characteristics of the hierarchical structure of the gastrointestinal tract and ultrasound images of the surrounding adjacent organs, thereby further improving the diagnostic level of endoscopy and ultrasound. The use of high-freq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B8/12
CPCA61B8/12A61B8/4483
Inventor 费春龙刘治勇林鹏飞李迪杨银堂
Owner XIDIAN UNIV
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