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Preparation method of metal microneedle array negative mold

A microneedle array and mold technology, which is applied in the direction of microneedles, needles, and medical devices, can solve the problems of easy deformation of polymer female molds, difficult processing technology, and difficult control of precision, etc., and achieves easy mass replication and preparation Microneedle array membrane, low processing cost, and stable physical properties

Active Publication Date: 2021-06-11
上海揽微医学科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Features of the present invention: anti-bonding layer is prepared on the microneedle array male mold, a metal seed layer is prepared on it, and the microneedle array female mold is prepared by electroplating, electroless plating or electroforming. This process is different from the existing The MEMS (Micro-Electro-Mechanical Micro-Mechanical System) process is compatible, and can be precisely matched with a specific microneedle array male mold to prepare a metal microneedle array female mold, which can solve the problem that the current polymer female mold is easy to deform, has a short life, and is difficult , the problem of disinfection at high temperature can also solve the defects of the current metal female mold processing technology, which is difficult, complicated, difficult to control the precision and difficult to reduce the cost

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  • Preparation method of metal microneedle array negative mold
  • Preparation method of metal microneedle array negative mold
  • Preparation method of metal microneedle array negative mold

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preparation example Construction

[0034] figure 1 It is a schematic diagram of the male microneedle array mold in the metal microneedle array female mold preparation process of the present invention; figure 2 It is a schematic diagram of the anti-adhesion layer and the metal seed layer coated on the surface of the microneedle array male mold in the metal microneedle array female mold process of the present invention; image 3 A schematic diagram of electroplating (or electroless plating or electroplating) the metal layer for the microneedle array positive mold surface coated with the anti-bonding layer and the metal seed layer; Figure 4 It is a schematic diagram of the metal microneedle array female mold process of the present invention coated with an adhesive layer on the surface of the female mold metal layer; Figure 5 It is the overall schematic diagram after adding the reinforcement layer in the metal microneedle array negative mold process of the present invention; Figure 6 In the metal microneedle ...

Embodiment 2

[0064] In this embodiment, the male mold of the microneedle array is prepared by MEMS (micromechanical microelectromechanical system). The material is various silicon substrates, the thickness is 200μm-3000μm, the microneedle diameter is 0.001μm-5000μm, and the microneedle height is 0.001μm-10,000μm. The material of this embodiment is preferably a double-polished single crystal silicon wafer, the diameter of the microneedle is 200 μm, and the height of the microneedle is 300 μm.

[0065] The shape of the microneedle in this embodiment is a square pointed cone. In order to ensure the density of the microneedle array, the distance between the microneedles in this embodiment is 400 μm.

[0066] In this embodiment, the anti-adhesion layer is a perfluoroalkoxy resin with a thickness of 100 nm.

[0067] In this embodiment, the material of the metal seed is Cr / Cu, and the thickness is 30 / 80 nm.

[0068] In this embodiment, it is preferably Cu, and the thickness is 2mm.

[0069] T...

Embodiment 3

[0092] The microneedle array positive mold is prepared by ultra-precision mechanical method. The material is glass, such as: quartz glass, ordinary silicate glass, etc., the diameter of the microneedle is 0.001 μm to 5,000 μm, and the height of the microneedle is 0.001 μm to 10,000 μm. The material used in this embodiment is ordinary silicate exfoliation, etc., the diameter of the microneedle is 50 μm, and the height of the microneedle is 150 μm.

[0093] In this embodiment, the microneedle is a hexagonal pointed cone.

[0094] The distance between the microneedles in this embodiment is 150 μm.

[0095] The anti-adhesion layer in this embodiment is an ethylene-tetrafluoroethylene copolymer with a thickness of 80 nm.

[0096] In this embodiment, the material of the metal seed is Cr / Ti, and the thickness is 30 / 50 nm.

[0097] In this embodiment, the female metal layer is Ni with a thickness of 0.5 mm.

[0098] In this embodiment, glass glue is selected as the bonding layer, a...

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Abstract

A method for preparing a metal microneedle array negative mold, including a method for preparing a metal microneedle array negative mold, comprising: preparing an anti-adhesion layer and a metal seed layer on a microneedle array positive mold; The seed layer is covered with a female metal layer; a reinforcing layer is applied on the surface of the female metal layer, and finally the male mold is removed to obtain the metal microneedle array female mold. The preparation method of the metal microneedle array negative mold of the present invention has the advantages of being able to be produced in large quantities at low cost, and capable of resisting high temperature and high pressure, and the shape and height of the microneedles are controllable, which is beneficial to industrialization Prepare large batches.

Description

technical field [0001] The invention relates to a method for preparing a workpiece, in particular to a method for preparing a mold, which is used for a metal microneedle array female mold Background technique [0002] Microneedle is a new type of physical penetration enhancement method that is considered to have great application prospects in recent years. It is a high-tech physical penetration enhancement technology born with the rapid development of micromachining technology. The size of the microneedles and the spacing between the microneedles are on the order of microns, which can easily pass through the stratum corneum without touching the subcutaneous nerve, so it will not cause pain. The microneedles mainly realize drug administration by solidifying the drug in the microneedle and then inserting it into the skin, or directly dissolving it in the skin. Microneedle technology can also be used in combination with other means of promoting penetration such as iontophoresi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61M37/00
CPCA61M37/0015A61M2037/0053
Inventor 李丁崔大祥邓敏郭仁凤
Owner 上海揽微医学科技有限公司
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