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A high-reliability lead frame processing technology for small plastic-encapsulated integrated circuits

A lead frame, integrated circuit technology, applied in circuits, electrical components, semiconductor devices, etc., can solve problems such as the inability to meet the production requirements of high-reliability integrated circuits, the instability of the first-level reliability of integrated circuits, and the impact on the reliability of packaging circuits. , to achieve the effect of good effect, not easy to delaminate, and increase the bonding force

Active Publication Date: 2020-02-14
华天科技(宝鸡)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the increasing degree of circuit integration, the volume of integrated circuits is getting smaller and smaller, such as SOP series, SOT series, etc., the package ratio is significantly reduced, which is equivalent to 1 / 3-1 / 4 of the original plastic package. The lead frame can only pass the three-level reliability (MSL3) test, which cannot meet the production requirements of high-reliability integrated circuits
However, the processing technology of the high-reliability lead frame currently used in the market only processes the copper surface of the lead frame ( figure 1 ), the first-level reliability of the integrated circuit after packaging is still unstable, especially in the silver-plated area and the second solder joint, which is prone to delamination and affects the reliability of the packaged circuit

Method used

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  • A high-reliability lead frame processing technology for small plastic-encapsulated integrated circuits
  • A high-reliability lead frame processing technology for small plastic-encapsulated integrated circuits
  • A high-reliability lead frame processing technology for small plastic-encapsulated integrated circuits

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A SOP008(90*90)F-12P high-reliability lead frame processing technology: such as figure 2 As shown, the lead frame is first subjected to conventional degreasing, activation, neutralization, copper plating, pre-silver plating, silver plating and silver stripping processes, and then the stripped lead frame is sequentially treated with Descabase with a concentration of 40 g / L CU, microetched at 20°C to roughen the surface microscopically, with a corrosion depth of 0.2 μm; use 15 mL / L of MoldPrep LF Activator, reactivate at 35°C to form an organic film on the surface; Add 230 g / L of MoldPrep HMC A, 190 g / L of MoldPrep LF Part C, 180 mL / L of MoldPrep HMC D, 15 g / L of MoldPrep LF Starter and 30 mL / L of MoldPrep in lead frame processing LF Part B, corrode and oxidize the surface of the organic film to form a brown oxide layer; at 20°C, keep the current at 1A, add 40g / L KOH solution and 75g / L MoldPrep PostDipEC to the lead frame for electrolysis , to clean off the copper powde...

Embodiment 2

[0034] A SOP008(70*70)A-12P high-reliability lead frame processing technology: such as figure 2As shown, the lead frame is first subjected to conventional degreasing, activation, neutralization, copper plating, pre-silver plating, silver plating and silver stripping processes, and then the stripped lead frame is sequentially treated with Descabase with a concentration of 60 g / L CU, microetched at 30°C to roughen the surface microscopically, with a corrosion depth of 0.4 μm; use 25 mL / L of MoldPrep LF Activator to reactivate at 45°C to form an organic film on the surface; At ℃, add 270 g / L MoldPrep HMC A, 210 g / L MoldPrep LF Part C, 200 mL / L MoldPrep HMC D, 20 g / L MoldPrep LF Starter and 35 mL / L MoldPrep LF Part to the lead frame B, corrode and oxidize the surface of the organic film to form a brown oxide layer; at 30°C, keep the current at 2A, add 55g / L KOH solution and 95g / L MoldPrep PostDipEC to the lead frame for electrolysis and cleaning Remove the copper powder on the s...

Embodiment 3

[0037] A SOP016(75*75)-12P high-reliability lead frame processing technology: such as figure 2 As shown, the lead frame is first subjected to conventional degreasing, activation, neutralization, copper plating, pre-silver plating, silver plating and silver stripping processes, and then the stripped lead frame is sequentially treated with Descabase with a concentration of 50 g / L CU, micro-etched at 25°C to roughen the surface microscopically, and the corrosion depth was 0.3μm; use 20mL / L MoldPrep LF Activator to activate again at 40°C to form an organic film on the surface; at 40°C Next, add 250 g / L MoldPrep HMC A, 230 g / L MoldPrep LF Part C, 220 mL / L MoldPrep HMC D, 25 g / L MoldPrep LF Starter and 40 mL / L MoldPrep LF Part B to the lead frame , to corrode and oxidize the surface of the organic film to form a brown oxide layer; at 30°C, keep the current at 2A, add 55g / L KOH solution and 95g / L MoldPrep PostDip EC to the lead frame for electrolysis and cleaning Remove the copper ...

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Abstract

The invention discloses a high-reliability lead frame processing technology for a small plastic-encapsulated integrated circuit, which belongs to the technical field of integrated circuit packaging. The high-reliability lead frame processing technology of the present invention is as follows: first, the lead frame is subjected to conventional degreasing, activation, neutralization, copper plating, pre-silver plating, silver plating and silver stripping processes, and then the lead frame after silver stripping is sequentially processed It is obtained after microetching, reactivation, copper surface treatment, anode cleaning, silver surface treatment, and silver protection process. The processing technology of the present invention increases the bonding force between the plastic encapsulant and the substrate in the packaging process through the treatment of the copper surface and the silver surface on the lead frame, and the integrated circuit is not easy to delaminate after packaging, thereby improving the reliability of the integrated circuit after packaging. Reliability; After multiple production line verifications, the integrated circuit after packaging can pass the first-level reliability test 100%, which can meet the production requirements of high reliability integrated circuits.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging, in particular to a high-reliability lead frame processing technology for small plastic-encapsulated integrated circuits. Background technique [0002] For a long time, for integrated circuits with large plastic packages, such as SSOP series, LQFP series, QFP series, etc., the ratio of the bonding surface of the plastic to the bonding surface of the entire plastic package, that is, the package is relatively large. It is strong and can pass the first-level reliability (MSL1) test, and it is not easy to cause delamination during processing and use, and the service life of the integrated circuit after packaging can be guaranteed. [0003] With the increasing degree of circuit integration, the volume of integrated circuits is getting smaller and smaller, such as SOP series, SOT series, etc., the package ratio is significantly reduced, which is equivalent to 1 / 3-1 / 4 of the original...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/495C25D9/08
CPCC25D9/08H01L21/4821H01L23/49579
Inventor 成军陈庆伟赵龙飞牟俊强周朝峰
Owner 华天科技(宝鸡)有限公司