Yield prediction method for resistance welding bridge
A prediction method, technology of solder resist bridge, applied in the field of circuit board processing, can solve the problem that the yield rate of solder resist bridge cannot be effectively estimated
Active Publication Date: 2018-08-17
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
[0004] Based on this, it is necessary to provide a method for predicting the yield rate of solder mask bridges for the problem that the yield rate of solder mask bridge processing cannot be effectively estimated
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[0040] Embodiments of the present invention are described in detail below in conjunction with accompanying drawings:
[0041] It should be noted that when an element is “fixed” to another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.
[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the descrip...
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The invention relates to a yield prediction method for a resistance welding bridge. The method comprises the following steps of obtaining a design bridge width of the resistance welding bridge according to a preset requirement; according to a preset condition, obtaining a preset lower bridge width minimum value and a preset upper bridge width minimum fluctuation value; according to the preset condition, obtaining a preset lateral erosion quantity mean and a preset lateral erosion quantity standard deviation; according to a first equation, determining a preset maximum lateral erosion quantity;and according to a second equation, determining the yield of resistance welding bridge processing. The bridge width is determined by change of a lateral erosion quantity, and the change of the lateralerosion quantity obeys normal distribution, so that by comprehensively considering multiple factors including the design bridge width, the preset lower bridge width minimum value, the preset upper bridge width minimum fluctuation value, the preset lateral erosion quantity mean and the preset lateral erosion quantity standard deviation, a first equation set is established to obtain a maximum valueof the lateral erosion quantity; a standard normal distribution function about the lateral erosion quantity is established; and integration is performed on the function to obtain a corresponding probability value, namely, the yield of the resistance welding bridge processing; and therefore, the prediction method for the yield of the resistance welding bridge processing is provided.
Description
technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a method for predicting the yield rate of a solder resist bridge. Background technique [0002] HDI is the abbreviation of High Density Interconnector. The HDI board is a kind of circuit board with high circuit distribution density processed by micro-blind buried hole technology. At present, electronic products are gradually developing in the direction of miniaturization and portability. The volume of electronic components is getting smaller and smaller, and the requirements for circuit boards and graphics production accuracy are getting higher and higher. [0003] Surface mount is a commonly used technology in circuit board processing. With the continuous improvement of circuit board processing accuracy and the continuous shrinking of electronic components, the solder resistance bridge is also continuously reduced. However, the reduction of the solder resistance...
Claims
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Login to View More IPC IPC(8): G06F17/50H05K3/28
CPCH05K3/282G06F30/39Y02P90/30
Inventor 廉泽阳李娟李艳国
Owner GUANGZHOU FASTPRINT CIRCUIT TECH