Epoxy resin conductive adhesive, electromagnetic shielding film, and preparation method of epoxy resin conductive adhesive and electromagnetic shielding film

An electromagnetic shielding film, epoxy resin technology, applied in the direction of conductive adhesives, adhesives, film/sheet adhesives, etc., can solve the problems of expensive, difficult to use, poor performance, etc., to achieve high conductivity, Simple process and high conductivity effect

Inactive Publication Date: 2018-08-21
广东鑫丰海电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This material proved to be expensive, difficult to work with, and susceptible to poor performance caused by cracking of the metallized layers

Method used

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  • Epoxy resin conductive adhesive, electromagnetic shielding film, and preparation method of epoxy resin conductive adhesive and electromagnetic shielding film
  • Epoxy resin conductive adhesive, electromagnetic shielding film, and preparation method of epoxy resin conductive adhesive and electromagnetic shielding film
  • Epoxy resin conductive adhesive, electromagnetic shielding film, and preparation method of epoxy resin conductive adhesive and electromagnetic shielding film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Table 1: The chemical composition of the electromagnetic shielding film epoxy resin conductive adhesive of the first embodiment

[0028]

[0029]

[0030] Based on the materials in Table 1, the preparation method of the epoxy resin conductive adhesive of the first electromagnetic shielding film is as follows:

[0031] Step 1, preparation of rubber solution: Cut 13 parts of soft nitrile rubber into 1 cm cubes, fully mix with 10 parts of methyl ethyl ketone, put it into the reaction ax and continue to stir for 24 hours, and stir at a constant temperature at a constant speed, and wait for 24 hours to completely dissolve After that, stand still to obtain a rubber solution.

[0032] Step 2, preparation of epoxy resin solution: crush 14 parts of glycidyl ester epoxy resin solid shape into small pieces, fully mix with 10 parts of methyl ethyl ketone, put it into the first dispersion bucket and keep stirring for 6 hours, and keep the temperature constant Stir at a consta...

Embodiment 2

[0037] Table 2: The chemical composition of the electromagnetic shielding film epoxy resin conductive glue of the 2nd embodiment

[0038]

[0039] Based on the materials in Table 2, the preparation method of the epoxy resin conductive adhesive of the second electromagnetic shielding film is as follows:

[0040] Step 1, preparation of rubber solution: Cut 15 parts of hard nitrile rubber into 1 cm cubes, fully mix them with 10 parts of MEK and put them into the reaction axe for 24 hours, keep stirring at a constant temperature and at a constant speed, and wait for 24 hours to completely dissolve , static rubber solution is obtained.

[0041] Step 2, preparation of epoxy resin solution: Crush 14 parts of diphenolic propane type epoxy resin into small pieces in solid shape, fully mix with 12 parts of MEK, put it into the first dispersion bucket and keep stirring for 6 hours, and keep the temperature constant Stir at a constant speed, and after 6 hours of complete dissolution, ...

Embodiment 3

[0046] Table 3: The chemical composition of the electromagnetic shielding film epoxy resin conductive glue of the 3rd embodiment

[0047]

[0048] Based on the materials in Table 3, the preparation method of the epoxy resin conductive adhesive of the third electromagnetic shielding film is as follows:

[0049] Step 1, preparation of rubber solution: Cut 14 parts of soft nitrile rubber into 1 cm cubes, fully mix with 10 parts of 2-oxobutane, put them into the reaction ax and continue to stir for 24 hours, and stir at a constant temperature and at a constant speed. After 24 hours of complete dissolution, stand still to obtain a rubber solution.

[0050] Step 2, preparation of epoxy resin solution: 14 parts of glycidyl ester epoxy resin solid shape is crushed into small pieces, fully mixed with 11 parts of 2-oxobutane and put into the first dispersion bucket for continuous stirring for 6 hours, and stirred at a constant temperature and at a constant speed. After 6 hours of co...

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PUM

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Abstract

The invention discloses an epoxy resin conductive adhesive, an electromagnetic shielding film, and a preparation method of the epoxy resin conductive adhesive and the electromagnetic shielding film. The epoxy resin conductive adhesive comprises butadiene-acrylonitrile rubber monomer, an anti-oxidant, an amine curing agent, an imidazole curing agent, a catalyst, an epoxy resin monomer, an acrylatemonomer, a butanone modifying agent, glass bead, and conductive nickle powder. The preparation method comprises following steps: the acrylic monomer is fully mixed with the epoxy monomer to be uniform, and the anti-oxidant, the amine curing agent, the imidazole curing agent, the catalyst, and conductive nickle powder are added, so that it is ensured that the epoxy resin conductive adhesive obtained via modification possesses excellent conductivity, high temperature resistance, adhesiveness, and electromagnetic shielding efficiency, the application value in the fields of electromagnetic wave protection and related fields is high. The preparation method and a film forming method of the epoxy resin conductive adhesive are simple, and manufacturing cost is low.

Description

technical field [0001] The invention relates to the technology in the field of chemical products, in particular to an epoxy resin conductive adhesive, an electromagnetic shielding film and a preparation method thereof. Background technique [0002] 3C products such as notebook computers, GPS, ADSL, and mobile phones will generate noise due to high-frequency electromagnetic wave interference, which will affect the communication quality. Therefore, anti-electromagnetic interference is a necessary and imperative process. [0003] It is common practice to provide shielding and / or grounding for electronic assemblies that use circuits that emit or are susceptible to EMI. These components may be shielded to reduce unwanted electromagnetic interference and / or mitigate susceptible effects by using conductive shields that reflect or dissipate electromagnetic charges and fields. Such shielding may be grounded to allow dissipation of undesired charges and electric fields without distu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J4/02C09J4/06C09J7/22
CPCC09J4/06C09J7/22C09J9/02C09J2301/122C09J2301/312C09J2301/314C09J2467/005C09J2467/006
Inventor 谭勇
Owner 广东鑫丰海电子科技有限公司
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