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A kind of flexible substrate and its preparation method, display device

A technology for flexible substrates and display devices, which is applied in the manufacture of semiconductor devices, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as low fracture deformation rate, device failure, and barrier layer loss of water and oxygen barrier properties. Water vapor barrier performance and the effect of improving the fracture deformation rate

Active Publication Date: 2022-03-18
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with the SiO2 and / or SiN structure is that SiO2 and SiN have a low fracture deformation rate, or form a porous structure at a low bending deformation, so that the barrier layer loses water and oxygen barrier properties and causes device failure

Method used

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  • A kind of flexible substrate and its preparation method, display device
  • A kind of flexible substrate and its preparation method, display device
  • A kind of flexible substrate and its preparation method, display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] figure 1 It is a schematic diagram of the flexible substrate structure of the first embodiment of the present invention. Such as figure 1 As shown, the flexible substrate includes a first polymer layer 120 , a barrier layer 130 and a second polymer layer 140 stacked in sequence.

[0037] In this embodiment, the materials of the first polymer layer 120 and the second polymer layer 140 include but are not limited to polymethyl methacrylate (PMMA), polyethylene terephthalate (PET ), polyethylene naphthalate (PBN), polycarbonate resin or polyimide (PI).

[0038] It should be noted that the materials of the first polymer layer 120 and the second polymer layer 140 may be the same or different.

[0039] It should also be noted that, in other embodiments, the flexible substrate may only include the first polymer layer 120 and the barrier layer 130 .

[0040] The barrier layer 130 includes titanium oxide (TiO 2 ) metal titanium layer and at least one inorganic film layer. ...

Embodiment 2

[0052] Such as Figure 4 As shown, the second embodiment of the present invention provides a flexible substrate preparation method, the method includes steps:

[0053] S210, forming an inorganic film layer on the polymer layer;

[0054] S220, forming a metal titanium layer containing titanium oxide on the inorganic film layer by self-passivation or process oxidation of metal titanium.

[0055] In one embodiment, said forming an inorganic film layer on the polymer layer comprises the steps of:

[0056] forming an inorganic film layer of an inorganic oxide on the polymer layer;

[0057] The formation of a metal titanium layer containing titanium oxide components on the inorganic film layer by oxidation of metal titanium process includes the steps of:

[0058] Metal titanium is magnetron sputtered, and a metal titanium layer containing titanium oxide is formed on the inorganic film layer after high-temperature annealing.

[0059] As an example, when an inorganic film layer of...

Embodiment 3

[0070] A third embodiment of the present invention provides a display device, which includes the flexible substrate described in the first embodiment. For the flexible substrate, reference may be made to the above content, and details are not repeated here.

[0071] In the display device provided by the embodiment of the present invention, the barrier layer includes a titanium oxide layer containing titanium oxide. On the one hand, it can be used as a water and oxygen barrier layer to improve the water vapor barrier performance of the flexible substrate, and on the other hand, it can increase the fracture deformation rate of the barrier layer. .

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Abstract

The invention discloses a flexible substrate, a preparation method thereof, and a display device. The flexible substrate includes sequentially stacked polymer layers and barrier layers; the barrier layer includes a metal titanium layer containing titanium oxide and at least one inorganic film layer. In the flexible substrate and its preparation method and display device disclosed in the present invention, the barrier layer includes a titanium oxide layer containing titanium oxide. On the one hand, it can be used as a water and oxygen barrier layer to improve the water vapor barrier performance of the flexible substrate; Fracture deformation rate of the barrier layer.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible substrate, a preparation method thereof, and a display device. Background technique [0002] Flexible substrates applied to flexible organic electroluminescent devices are mainly polymer substrates, such as polyimide (PI). Since the structure of the polymer substrate itself determines that its water and oxygen permeability is relatively high, a common method in the industry is to coat the PI substrate with a multi-layer barrier layer to prevent the immersion of water and oxygen. [0003] In the process of realizing the present invention, the inventor found that the problem in the prior art is that the barrier layer of the flexible substrate adopts PECVD (Plasma Enhanced Chemical Vapor Deposition, plasma enhanced chemical vapor deposition method) to form SiO2 and / or SiN The structure acts as a water-oxygen barrier. The problem with the SiO2 and / or SiN structure is th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/00H01L51/56H01L27/32H10K99/00
CPCH10K59/00H10K77/111H10K71/00Y02E10/549
Inventor 孙冰刘金强刘晓佳
Owner YUNGU GUAN TECH CO LTD