Full-color LED display module, packaging method and display screen of full-color LED display module

Abstract

The invention discloses a packaging method of a full-color LED display module. The method comprises the steps of 1, coating the package resin on a separation film; 2, placing a separation plate on a first jig, and placing the separation film coated with the package resin on the separation plate, wherein the side of the separation film with the package resin is placed upwards; 3, placing the solid-crystal full-color LED display module substrate on the package resin, placing the chip of a full-color LED display module substrate to be downwards, and then placing a second jig; 4, combining the first jig and the second jig, and putting the first jig and the second jig into a vacuum air compressor for vacuum lamination; 5, after the lamination is completed, taking out the full-color LED displaymodule substrate, tearing off the separation film, and finishing the packaging operation. Correspondingly, the invention further provides a full-color LED display module and a display screen of the full-color LED display module. By the adoption of the method, the diversified selection of packaging sizes and packaging materials can be realized. The packaging quality is good, and the foaming is avoided. The requirement on packaging equipment is low.

Description

technical field [0001] The invention relates to the field of packaging of full-color LED display modules, in particular to a full-color LED display module and its packaging method and display screen. Background technique [0002] The full-color LED display module is an integrated circuit and does not need to be mounted again. Each package unit integrates multiple sets of pixel units. The traditional flat full-color LED display module packaging process must use stencil printing or molding. [0003] However, stencil printing requires the use of high-viscosity glue, which has low selectivity and requires high substrate flatness and thickness consistency. Moreover, high-viscosity glue needs to be printed under vacuum, which requires high equipment. [0004] Molding has poor applicability to the size of the substrate. RGB COB needs to solder the electronic components on the back before packaging, which makes the mold structure of the Molding equipment complex and the mold proces...

AI Technical Summary

Problems solved by technology

Therefore, reference document 1 cannot realize various choices of packaging materials

[0008] Moreover, the preparation process of the fluorescent film in Comparative Document 1 is complicated and takes a long time. After removing the film that has been initially cured at 80-90°C for 2-3h, it needs to be cured at 120-130°C for 1-2h. Many RGB packaging adhesives have already Cured, cannot be applied to the field of full-color LED display modules

[0009] Reference 1 is to use a laminator to package the phosphor film on the blue film with the flip chip attached, and tear off the blue film after heating and curing. Therefore, it cannot realize various choices of package size.

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