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2results about How to "Improved size adaptability" patented technology

A high-precision substrate bonding device for very warm liquid environments

ActiveCN119189481BImprove fitting accuracyMeet the need for fitLamination ancillary operationsLaminationTemperature controlVisual positioning
The application relates to the technical field of panel display, in particular to a high-precision substrate laminating device for a very warm liquid environment. The device comprises a base, a protective cover, a pressing module, a temperature control module, a lower laminating table and a visual positioning module. The base is provided with the protective cover. The pressing module is fixedly installed on the base in the protective cover and used for installing an upper substrate. The temperature control module is installed on the base in an inclined manner below the pressing module. The lower laminating table is installed in the temperature control module in an inclined manner and used for installing a lower substrate. The visual positioning module is fixedly installed on the base at one side of the temperature control module and extends into the temperature control module and is used for positioning the substrate. The application has the advantages of high laminating precision, good size adaptability, provision of a very warm working environment and reduction of bubble phenomenon, solves the problems of low laminating precision, poor size adaptability, only suitable for normal temperature use and easy bubbling of existing substrate laminating equipment, and meets the needs of substrate lamination in a very warm liquid.
Owner:WUHAN NATIONAL INNOVATION TECHNOLOGY OPTOELECTRONICS EQUIPMENT CO LTD

Intrinsic strain field calibration method and system based on stress inversion and numerical optimization

PendingCN122347001AImprove forecast accuracyAchieve independent calibrationElement modelStress measurement
The present application proposes a stress inversion and numerical optimization based intrinsic strain field calibration method and system, belonging to the technical field of metal additive manufacturing numerical simulation. The present application solves the problems in the existing strain field calibration method, such as the lack of feedback calibration mechanism based on measured stress, the focus on residual deformation only, the inability to verify the material constitutive model, the poor generalization of intrinsic strain parameters, and the significant deviation between the prediction results of complex components and the actual measurement. The method comprises the following steps: S1: preparing a calibration sample according to the target material; S2: obtaining the measured value of residual stress at the measurement point of the calibration sample; S3: establishing a finite element model of the calibration sample; S4: establishing a target function and performing automatic iterative solution to obtain the optimal solution of the design variable. The system comprises a calibration sample preparation module, a stress measurement module, a modeling module and a design variable solving module.
Owner:HARBIN INST OF TECH