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3results about How to "Help miniaturization" patented technology

An air fryer

ActiveCN224403453UAdjust the shading areaPrecise position controlAir volumeElectric machine
The application discloses an air fryer, which comprises a cooking cavity and a fan for sending air into the cooking cavity, the cooking cavity is provided with an exhaust port communicated with the outside atmosphere, and the air fryer further comprises a motor, a one-way driving assembly and an air outlet adjusting device arranged at the exhaust port, the motor is connected with the fan and the one-way driving assembly through a motor shaft; when the motor drives the fan to rotate forward, the one-way driving assembly does not drive the air outlet adjusting device to move, when the motor drives the fan to rotate reversely, the one-way driving assembly drives the air outlet adjusting device to move so as to adjust the air outlet amount at the exhaust port. In the application, the fan for sending air into the cooking cavity and the one-way driving assembly for driving the air outlet adjusting device to move share one motor, the number of motors is reduced, the cost is lowered, the structure is more compact, the internal layout is more reasonable, and the miniaturization of the air fryer is facilitated.
Owner:HONGYANG HOME APPLIANCES

Bonding pad of crystal grain and electronic device with crystal grain

PendingCN121985852Ahelp miniaturizationlow costStructural engineeringMechanical engineering
The invention discloses a bonding pad of a die and an electronic device having the same. The electronic device comprises a carrier plate, a first crystal grain and a second crystal grain. The first die is disposed on the carrier and includes a first bonding pad and a second bonding pad. The second die is disposed on the carrier and includes a third bonding pad and a fourth bonding pad. The first bonding pad is directly connected with the third bonding pad through a first bonding wire, and the second bonding pad is directly connected with the fourth bonding pad through a second bonding wire. The first bonding pad is provided with an inner concave space, and the second bonding pad is arranged in the inner concave space.
Owner:REALTEK SEMICON CORP

Periodic branch microstrip double-line with wing-type compensation structure for suppressing microstrip line far-end crosstalk

The invention discloses a periodic branch microstrip double-line with a wing-shaped compensation structure for suppressing microstrip line far-end crosstalk, and the periodic branch microstrip double-line comprises two parallel periodic branch microstrip lines, and discrete wing-shaped compensation units which are uniformly distributed between the two periodic branch microstrip lines. And the wing-shaped compensation units and the microstrip line branches are arranged in a staggered manner. According to the periodic branch microstrip double-line with the wing-shaped compensation structure, the periodic microstrip line structure and the wing-shaped compensation structure are designed, capacitive coupling between the compensation lines is realized, so that far-end crosstalk is reduced, and the suppression effect is optimal by scanning and optimizing structural parameters. Compared with a traditional microstrip line, the microstrip line is lower in far-end crosstalk, small in line spacing and capable of effectively saving wiring space.
Owner:NANJING UNIV OF SCI & TECH