4results about How to "Simplify Thermal Design" patented technology

The application discloses an energy-saving LED display screen with a reverse common cathode and a driving method thereof, and belongs to the technical field of LED display. The application aims at the problem that the single voltage power supply of the traditional common anode LED display screen leads to high power consumption and serious heat generation of the first display content LED, and adopts a reverse common cathode structure of dynamic anode voltage switching + cathode time-sharing gating: the ICND2018 row driving IC provides switchable double voltages for the common anode of the LED, outputs 2.6~2.8V low voltage when the first display content is displayed, and outputs 3.6~3.8V standard voltage when the second display content and the third display content are displayed; three pieces of ICND1065L16 channel constant current sink column driving IC are matched to independently control the three-color cathodes of the first display content, the second display content and the third display content, and precise power supply of color separation is realized. Under the premise of being fully compatible with the existing SMDTOP three-in-one common anode lamp beads, the first display content LED loop voltage difference is reduced from 1.8V to 0.8V, and the power consumption of the single first display content lamp is reduced by about 55%.

The application provides a bimetallic nanoparticle-based acetone gas sensor and a preparation method thereof. The preparation method comprises the following steps: adding tin chloride into a solution containing a complexing agent and deionized water, stirring for 10 minutes at 60 DEG C, then adding ammonia water until the pH reaches 3, and obtaining a tin hydroxide precipitate powder after centrifugal washing; adding the tin hydroxide precipitate powder into indium trichloride tetrahydrate powder, gold chloride powder and platinum tetrachloride powder in sequence, and performing ball milling mixing, sintering at 600 DEG C for 2 hours, and obtaining bimetallic nanoparticle; adding ethylene glycol and zirconium oxide ball milling beads into the bimetallic nanoparticle, performing ball milling for 8 hours, obtaining a point glue solution, coating the point glue solution on a micro motor heating plate, drying at room temperature, and sintering at 200-400 DEG C for 3-4 hours, and obtaining the bimetallic nanoparticle-based acetone gas sensor. Therefore, the excitation temperature can be effectively reduced, and the selectivity to acetone gas can be improved.

A heat dissipation channel assembly structure of a refrigerator comprises a condensation pipe arranged in a refrigerator body and further comprises a fan, a heat exchange assembly and an air outlet assembly, an air duct cavity used for containing the fan, the heat exchange assembly and the air outlet assembly is formed in the refrigerator body, the condensation pipe is communicated with the heat exchange assembly, and an air inlet and an air outlet which are communicated with the outside are formed in the refrigerator body. The air inlet, the air duct cavity, the air outlet assembly and the air outlet are sequentially communicated to form a circulating heat dissipation path. The heat dissipation channel assembly structure of the refrigerator is improved on the basis of a traditional side face heat dissipation mode, the heat dissipation channel assembly of the refrigerator is additionally arranged, when the refrigerator runs, the condensation pipe transmits heat to the condenser, the fan blows hot air and water vapor above the evaporation pan into the micro channel, heat exchange is conducted between the hot air and cold air outside the refrigerator body, and heat dissipation is achieved. Meanwhile, cold air is introduced through the air inlet, a circulating heat dissipation path is formed, the heat exchange area of the structure is large, efficient heat dissipation can be achieved, forced convection is combined, the heat exchange efficiency is improved, and the heat dissipation design is simple.

The invention discloses a power module. The power module comprises a power chip, an integrated bottom plate structure and a preformed lead terminal combination structure, a surface copper layer of the integrated bottom plate structure is provided with a chip mounting area and an electrical connection pattern of a circuit topology; and the bottom surface of the copper bottom plate is a heat dissipation surface. The power chip is mounted in the chip mounting area. The lead terminals of the preformed lead terminal combination structure penetrate through the first PCB and are welded and fixed through copper foil arranged on the first PCB, and the corresponding lead terminals are electrically connected through the copper foil. And the terminal inner side section of each lead terminal is provided with a bent structure, and the end part of each lead terminal is provided with a terminal welding pin. The terminal outer side section of each lead terminal is parallel to the width edge of the copper bottom plate and extends to the outer side of the length edge of the copper bottom plate to form an external connection structure fixedly connected with the driving PCB, and the end face of the external connection structure and the heat dissipation face are of a vertical structure so that 90-degree installation can be achieved. The mounting space can be saved, the heat dissipation path is optimized, and the assembly efficiency can be improved.