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Epoxy resin composition

A technology of epoxy resin and composition, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of low filling ability of underfill material, easy to generate voids when filling, etc., and achieve good filling ability, The effect of preventing failure and suppressing the generation of voids

Pending Publication Date: 2018-08-03
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, the conventional alumina fillers obtained in Patent Documents 2 to 4 have a large average particle diameter D50 of 2 μm or more based on the laser diffraction scattering method. Therefore, when added to an underfill material for three-dimensional mounting, the This underfill material has low fillability, so it is easy to generate voids when filling

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0092] (Preparation of epoxy resin composition)

[0093] The liquid sealing material of the present invention is prepared by mixing and stirring the above-mentioned components (A) to (C) and, if contained, components (D) and (E) and other compounding ingredients as needed.

[0094] The mixing and stirring can be performed using a roll mill, but of course it is not limited thereto. When the epoxy resin of (A) component is solid, it is preferable to make it liquefied or fluidized by heating etc., and to mix them.

[0095] Each component may be mixed at the same time, or it may be changed suitably so that a part of components may be mixed first, and then the remaining components may be mixed.

[0096] Next, the characteristics of the epoxy resin composition of the present invention will be described.

[0097] The epoxy resin composition of the present invention preferably has a viscosity of 200 Pa·s or less at room temperature (25° C.), and has good injectability when used as a...

Embodiment 1～4、 comparative example 1～2

[0117] The raw materials were kneaded using a roll mill to prepare the epoxy resin compositions of Examples 1-4 and Comparative Examples 1-2 so as to have the compounding ratios shown in the following tables. In addition, the numerical value concerning each composition in a table shows a mass part.

[0118] (A) epoxy resin

[0119] Epoxy resin A1: bisphenol F type epoxy resin, product name YDF8170, manufactured by Nippon Steel Chemical Co., Ltd., epoxy equivalent 158g / eq

[0120] (B) curing agent

[0121] Curing agent B1: Amine-based curing agent, 4,4'-diamino-3,3'-diethyldiphenylmethane, product name KAYAHARD A-A, manufactured by Nippon Kayaku Co., Ltd.

[0122] (C) Alumina filler

[0123] Alumina filler C1: average particle size 0.7μm, uranium content 0.1ppb

[0124] Alumina filler C2: average particle size 0.7μm, uranium content 3ppb

[0125] Alumina filler C3: average particle size 0.7μm, uranium content 9ppb

[0126] Alumina filler C4: average particle size 0.7μm, u...

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PUM

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Abstract

The present invention provides an epoxy resin composition which is suitable as an under-fill material for three-dimensional packaging, and has a low uranium content and excellent filling properties, and in which the occurrence of voids is inhibited. The epoxy resin composition according to the present invention contains (A) a liquid epoxy resin, (B) a curing agent, and (C) an alumina filler, and is characterized in that alumina filler (C) has an average particle size of 0.1-4.9 [mu]m, and the uranium content is 0.1-9 ppb.

Description

technical field [0001] The present invention relates to an epoxy resin composition used as a semiconductor sealing material or an adhesive. Background technique [0002] Along with miniaturization, weight reduction, and high performance of electronic equipment, the mounting form of semiconductors has changed from a wire bonding type to a flip chip type. [0003] A flip-chip type semiconductor device has a structure in which an electrode portion on a substrate and a semiconductor element are connected via bump electrodes. In the semiconductor device with this structure, stress is applied to the bump electrodes due to the difference in thermal expansion coefficient between the substrate made of an organic material such as epoxy resin and the semiconductor element when a heat load is applied such as a temperature cycle, and defects such as cracks occur on the bump electrodes. question. In order to suppress the occurrence of this defect, it is widely used to seal the gap betwe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/50C08K3/22C08K5/54C09J11/04C09J11/06C09J163/00H01L21/60H01L23/29H01L23/31
CPCC08G59/50C08K3/22C09J11/04C09J11/06C08K5/54C09J163/00C08L63/00H01L23/29H01L23/31H01L2224/29C08G59/5033H01L23/295C08K2003/2227
Inventor 长谷川将宏
Owner NAMICS CORPORATION
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