Micro electro mechanical combined logic device applied to fuze security and preparation method thereof
A combinational logic, micro-electromechanical technology, applied in electric solid devices, processes for producing decorative surface effects, piezoelectric/electrostrictive/magnetostrictive devices, etc., can solve the difficulty of micro-electromechanical security systems to adapt to the complex environment of the battlefield , the failure of the fuze security system, and the reduction of problems such as effectively attacking the enemy, to achieve the effects of wide practicability, low power consumption, and easy production
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[0039] The present invention will be further elaborated below through specific embodiments in conjunction with the accompanying drawings.
[0040] Such as figure 1As shown, the micro-electromechanical combined logic device applied to fuze security in this embodiment includes: an insulating substrate 4, a package shell 3, a signal interconnection pad 5, an anti-constant current interference unit 1 and an electrostatic energy dredging unit 2; wherein, A package shell is formed on the insulating substrate, and the package shell is a hemispherical shell, thereby forming a closed hemispherical cavity between the package shell and the insulating substrate; in the cavity, a plurality of anti-constant current interference units 1 and the electrostatic energy channeling unit 2 are arranged on the insulating substrate. Multiple pairs of signal interconnection pads 5 are provided on the insulating substrate, each pair of signal interconnection pads is respectively located inside and out...
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