Manufacturing methods of electrolytic copper foil having needle-shaped copper particles and circuit board assembly

Abstract

The invention discloses manufacturing methods of an electrolytic copper foil and circuit board assembly. The manufacturing methods of an electrolytic copper foil having needle-shaped particles includeforming a copper foil by an electrolyzing process, wherein the foil layer has a predetermined surface. Then, a surface treatment layer is formed on the predetermined surface of the copper foil to form an electrolytic copper foil having a needle-shaped structure on a surface layer. The surface treatment layer includes a plurality of needle-shaped copper particles, and a needle-shaped arrangement space exists between two adjacent needle-shaped copper particles. The steps of forming the surface treatment layer further includes performing a first electrolytic roughening treatment and a first electrolytic curing treatment, in which a first electrolyte solution used in the first electrolytic roughening treatment includes copper ions, sulfuric acid, arsenic trioxide, and tungstate ions, in whichthe copper concentration ranges from 3 to 40 g / L, the sulfuric acid concentration ranges from 100 to 120 g / L, the arsenic trioxide concentration is not more than 20 ppm, and the tungstate ion concentration ranges from 5 to 20 ppm. Thus, since the surface layer has the electrolyte copper foil having the needle-shaped structure and has a larger contact area with a resin substrate, higher peeling strength can be achieved.

Description

technical field [0001] The present invention relates to a method for manufacturing electrolytic copper foil and a circuit board assembly, in particular to a method for manufacturing an electrolytic copper foil with a fluffy structure on the surface, and a circuit board assembly using an electrolytic copper foil with a fluffy structure on the surface Production method. Background technique [0002] The existing copper foil used in printed circuit boards will be electroplated on the cathode wheel to form the original foil, and then undergo a post-processing process to form the final product. Post-processing includes roughening the rough surface of the original foil to form multiple copper nodules on the rough surface of the original foil, thereby increasing the bonding strength between the copper foil and the circuit substrate, that is, increasing the peel strength of the copper foil. [0003] However, electronic products tend to be high-frequency and high-speed in recent yea...

AI Technical Summary

Problems solved by technology

In this way, although the roughness of the copper foil can be maintained at a default value, the peel strength of the copper foil will be insufficient when the copper foil is bonded to the high-frequency substrate

[0005] However, if you try to reduce the high-frequency signal transmission loss by reducing the roughness of the copper foil surface, it will reduce the peel strength of the copper foil and the circuit substrate.

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