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Preparation method of copper-aluminum composite plate strip

A copper-aluminum composite plate and copper plate technology, applied in the field of copper-aluminum composite plate, can solve the problems of affecting the performance of materials and reducing the bonding strength of composite plates and strips, so as to improve the deep drawing performance, easy physical occlusion, and improve the interface bonding strength. Effect

Active Publication Date: 2018-09-11
湖南科罗德新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the heat treatment process of the copper-aluminum composite board, CuAl and CuAl are easily formed at the interface. 2 、Cu 4 Al 9 These brittle phases will lead to a decrease in the bonding strength of the composite strip, thereby affecting the performance of the material

Method used

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  • Preparation method of copper-aluminum composite plate strip
  • Preparation method of copper-aluminum composite plate strip
  • Preparation method of copper-aluminum composite plate strip

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0033] This embodiment provides a method for preparing a copper-aluminum composite strip, which includes the following steps:

[0034] Step 1. According to the requirements of the finished product, select a copper plate and an aluminum strip whose size meets the requirements, wherein the copper plate is used as the substrate material, and the aluminum strip is used as the embedded material;

[0035] Step 2: Perform uniform annealing treatment on the copper plate: the annealing temperature is 320-400°C, the holding time is 0.5-3h, and perform the homogenizing annealing treatment on the aluminum strip: the annealing temperature is 180-220°C, the holding time is 1-3h, Water quench the copper plate and aluminum strip after annealing;

[0036] Step 3. Perform surface pretreatment on the copper plate and aluminum strip to remove oil stains, surface scale and other impurities, and polish the surface roughness of the embedded groove of the copper plate to 60~80 μm, and polish the surf...

Embodiment 2

[0046] On the basis of Embodiment 1, this embodiment further provides a transformable implementation mode, which differs from Embodiment 1 in that:

[0047] In step five, heat treatment includes the following steps:

[0048] a. Under the protection of inert gas, perform annealing heat treatment on the copper-aluminum cold-rolled clad plate: gradually raise the temperature to 320 ° C ~ 360 ° C, keep it for 1 ~ 3 hours and then cool to room temperature;

[0049] B. carrying out several times of cold finish rolling to the copper-aluminum composite plate after step a processing;

[0050] c. Under the protection of mixed gas of nitrogen and hydrogen, heat-treat the copper-aluminum composite panel treated in step b again: the treatment temperature is 480°C~560°C, and the treatment time is 2~5min, and then the finished product is obtained.

[0051] In step b, 5-8 passes of cold finish rolling are performed at a rolling speed of 10-20 m / min.

[0052] In step c, when the composite st...

Embodiment 3

[0055] Such as figure 2 As shown, on the basis of Example 1, this embodiment further provides a specific embodiment, the purpose of which is to prepare a copper-aluminum composite strip with a double composite aluminum strip with an overall thickness of 2.00mm and an aluminum strip thickness of 0.15mm ; Concrete preparation method is as follows:

[0056] Step 1. Select a copper plate with a thickness of 20.00mm as the substrate material, and select an aluminum strip with a thickness of 1.5mm as the embedded material;

[0057] Step 2: Carry out uniform annealing treatment on the copper plate: the annealing temperature is 370°C, the holding time is 2h, and the aluminum strip is subjected to homogenizing annealing treatment: the annealing temperature is 190°C, the holding time is 1.5h, after the annealing is completed, the copper plate and aluminum with water quenching;

[0058] Step 3: Clean the copper plate and aluminum strip with a concentration of 10% NaOH solution to remo...

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Abstract

The invention discloses a preparation method of a copper-aluminum composite plate strip. The preparation method comprises the following steps that a copper plate and an aluminum strip with the sizes conforming to the requirements are selected according to the requirement of a finished product, wherein the copper plate serves as a base plate material, and the aluminum strip serves as an embedded material; homogenizing annealing treatment is conducted on the copper plate, wherein the annealing temperature is 320-400 DEG C, and the heat preservation time is 0.5-3 hours; homogenizing annealing treatment is conducted on the aluminum strip, wherein the annealing temperature is 180-220 DEG C, and the heat preservation time is 1-3 hours, and water quenching is conducted after annealing treatment is completed; surface pre-treatment is conducted on the copper plate and the aluminum strip, grease, surface oxidated scale and other impurities are removed, and surface roughness polishing is conducted on the copper plate and the aluminum strip; the aluminum strip is embedded into an embedding groove of the copper plate, and then multi-pass cold rolling cladding treatment is conducted; high temperature thermal treatment is conducted on the copper-aluminum composite plate which is subjected to cold rolling cladding under the atmosphere protection, and the needed finished product is obtained; and through early thermal treatment, surface pre-treatment, the multi-pass cold rolling and thermal treatment annealing technology, the copper-aluminum composite plate with an interface transition structural layer excellent in property is accordingly obtained.

Description

technical field [0001] The invention relates to the technical field of copper-aluminum composite boards, in particular to a preparation method of copper-aluminum composite board strips. Background technique [0002] Copper-aluminum composite plate is a new type of material that is welded together by copper plate and aluminum plate through cold rolling, hot rolling, explosive composite method, explosive rolling method, etc., and cannot be separated. [0003] According to the process attributes of the general bimetallic cladding process, there are melting and casting cladding methods, explosive cladding methods, welding cladding methods, rolling cladding methods, etc. However, when preparing copper-aluminum composite panels, copper and aluminum are easily oxidized during the melting and casting process, resulting in low interface bonding strength. Explosive cladding has problems such as poor pattern, complicated process and high cost. Welding cladding is due to the physical I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21C37/02C22F1/04C22F1/08
Inventor 王日初董翠鸽罗森晖
Owner 湖南科罗德新材料有限公司
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