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A kind of inorganic bonding glaze and preparation method thereof

An inorganic bonding and bonding technology, which is used in the field of inorganic bonding glaze for bonding ultra-high voltage hollow porcelain insulators and its preparation, can solve problems such as brittleness and elasticity cannot reach ideal values, electrical properties are difficult to guarantee, and bubbles are generated. , to achieve the effect of improving strength, improving bonding strength, and improving bonding strength

Active Publication Date: 2021-01-15
SUZHOU PORCELAIN INSULATOR WORKS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still deficiencies in organic bonding: easy aging, brittleness and elasticity still cannot reach the ideal value, and electrical properties are difficult to guarantee
Gong Yunxia, ​​Yang Hai, and Yu Yanxia (2013) proposed to improve the bonding strength by reducing the gas phase in the glaze. They also emphasized that calcined clinker should be selected as much as possible, such as cooked Datong, cooked talc and other raw materials. , to reduce the emission of volatiles during the firing process, but at the same time they used dolomite (CaMg(CO 3 ) 2 ) such raw materials that can generate a lot of gas; they also add ZrO in the process of glaze making 2 In order to improve the strength of the glaze; although there are some improvements, according to the existing literature, most inorganic adhesive glazes still belong to the category of raw material glazes, and air bubbles will still occur during the firing process

Method used

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  • A kind of inorganic bonding glaze and preparation method thereof
  • A kind of inorganic bonding glaze and preparation method thereof
  • A kind of inorganic bonding glaze and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A preparation method of inorganic bonding glaze, comprising the steps of:

[0033] In this embodiment, the electric enamel is used as the basic glaze. First, the composition characteristics of the electric enamel are analyzed. Electric enamel must have good working performance, such as good suspension and sufficient uniform dispersion, so that it can be smoothly absorbed by the dry body during glazing to form a uniform glaze layer, and it can mature smoothly at high temperature and form a firm body. The glaze bonding layer can also improve the mechanical strength of the electric porcelain.

[0034] For example, in the brown glaze of an electric porcelain manufacturing company, the 5# brown glaze formula is particularly mature. On the basis of it, slight adjustments have been made to form 6# and 7# formulas (see Table 1). Its main raw materials are feldspar powder, quartz sand, field soil, mud, field master, porcelain powder, calcite, talcum powder, iron, chromium, mang...

Embodiment 2

[0051] In order to discuss the effect of applying the glaze powder or the glaze paste of the inorganic bonding glaze, the bonding tests of the two forms of the inorganic bonding glaze were carried out in the same planar interface porcelain test strip respectively. The cutting and loading of the test strip are shown in the photo.

[0052] The dry method of directly glazing powder and the wet method of directly using glaze paste are used for glazing respectively. A small amount of silica sol is added to the glaze paste to enhance its bonding ability. Determine its flexural strength after firing to evaluate its bonding effect (Table 5).

[0053] Glazing method 1 2 3 4 5 6 7 average value dry method 70 75 73 69 75 65 68 71 wet strength 86 84 80 79 77 84 90 83

[0054] Judging from the situation at the interface of the glaze, there are more and larger bubbles at the section of dry bonding, while at the section of wet bonding, altho...

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Abstract

The invention relates to an inorganic adhesive glaze and a preparation method thereof. According to the preparation method, basic glaze, borax, and soda feldspar are mixed, the mixture is burned at atemperature of 1200 to 1500 DEG C to prepare basic glaze melt; the basic glaze melt is quenched by water to obtain basic glaze frits; the added borax accounts for 2 to 6 wt% of basic glaze, the addedsoda feldspar accounts for 2 to 8 wt% of basic glaze; the basic glaze frits obtained in the step one is mixed with a nucleating agent, and finally the mixture is grinded to obtain the inorganic adhesive glaze. The preparation method is novel, and the prepared inorganic adhesive glaze has the advantages of high bonding strength and good stability.

Description

technical field [0001] The invention relates to an inorganic bonding glaze and a preparation method thereof, in particular to an inorganic bonding glaze for bonding ultra-high voltage hollow porcelain insulators and a preparation method thereof. Background technique [0002] With the continuous improvement of the voltage level of power transmission and transformation projects, the height of the supporting hollow insulators also increases. For example, the height of 800kV switch porcelain insulator products reaches 10m and above, and the maximum outer diameter reaches 1100mm. Under the existing technical conditions, this kind of ultra-large porcelain insulator cannot be manufactured by integral molding and integral firing. Generally, it is formed by segmented molding, segmented firing, and finally the sintered porcelain pieces are bonded and combined. Organic bonding and inorganic bonding are the two most commonly used bonding methods. [0003] Organic bonding, that is, usi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C8/02C03C8/14C03C8/20C03C8/24C04B37/00
CPCC03C8/02C03C8/14C03C8/20C03C8/24C04B37/003
Inventor 李玉平马天齐郭爱芬高应霞肖万芬
Owner SUZHOU PORCELAIN INSULATOR WORKS