Preparation apparatus and preparation method of polyimide thick membrane or polyimide ultrathick membrane

A polyimide thick film, polyimide technology, applied in the direction of coating, etc., can solve the problem that the polyamic acid solvent is difficult to volatilize, achieve the effect of improving volatilization, realizing recovery and recycling, and simple structure

Active Publication Date: 2018-09-14
GUANGXI NORMAL UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The preparation device of polyimide thick film or polyimide ultra-thick film of the present invention solves the problem of premature hardening of the transition state surface of polyamic acid in the heat treatment furnace in the prior art, which makes the solvent in polyamic acid difficult to volatilize Problem, polyimide thick film or polyimide ultra-thick film with a thickness greater than 50 μm can be prepared, and the structure is simple and easy to operate

Method used

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  • Preparation apparatus and preparation method of polyimide thick membrane or polyimide ultrathick membrane

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Experimental program
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Effect test

Embodiment 1

[0047] Such as figure 1 As shown, a preparation device for a polyimide thick film or a polyimide ultra-thick film of the present embodiment includes a housing 1, and the inside of the housing 1 is provided with a metal plate 2 parallel to the bottom surface of the housing 1. The metal plate 2 divides the interior of the housing 1 into two mutually independent heating chambers 3 and a cooling chamber 4 located on the upper part of the heating chamber 3, the top of the heating chamber 3 is provided with a heating pipe 5 parallel to the metal plate 2, The two sides of the cooling chamber 4 are respectively provided with an air inlet 6 and an air outlet 7, and the outer side of the housing 1 is provided with a blower 8, and the blower 8 communicates with the cooling chamber 4 through the air inlet 6. A thermocouple 9 is arranged in the middle of the metal plate 2 .

[0048] The preparation device of polyimide thick film or polyimide ultra-thick film of this embodiment, when polya...

Embodiment 2

[0060] The device for preparing a polyimide thick film or polyimide ultra-thick film in this embodiment is the same as that in Embodiment 1. Wherein, the material of the metal plate 2 is copper plate.

[0061] A condensation recovery device 10 is also provided outside the housing 1 , and the condensation recovery device 10 communicates with the cooling chamber 4 through the air outlet 7 .

[0062] The method for preparing a polyimide thick film or a polyimide ultra-thick film using the above-mentioned polyimide thick film or polyimide thick film preparation device of this embodiment includes the following steps:

[0063] Step 1: Under the protection of nitrogen atmosphere, add 20.00g of 3,4'-diaminodiphenyl ether into 330g of N,N-dimethylacetamide solution, stir at room temperature to dissolve, then slowly add 29.39g in several times

[0064] 3,3',4,4'-biphenyltetracarboxylic dianhydride was stirred for 6 hours after the addition to obtain a viscous polyamic acid solution (so...

Embodiment 3

[0071] The device for preparing a polyimide thick film or polyimide ultra-thick film in this embodiment is the same as that in Embodiment 1. Wherein, the material of the metal plate 2 is aluminum plate.

[0072] A condensation recovery device 10 is also provided outside the housing 1 , and the condensation recovery device 10 communicates with the cooling chamber 4 through the air outlet 7 .

[0073] The method for preparing a polyimide thick film or a polyimide ultra-thick film using the above-mentioned polyimide thick film or polyimide thick film preparation device of this embodiment includes the following steps:

[0074] Step 1: Under the protection of nitrogen atmosphere, add 13.00 g of p-phenylenediamine and 8.03 g of 4,4'-diaminodiphenyl ether into 390 g of N,N-dimethylformamide solution, stir at room temperature to dissolve, and slowly Add 47.60 g of 3,3',4,4'-biphenyltetracarboxylic dianhydride several times, and stir for 6 hours after the addition to obtain a viscous ...

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Abstract

The invention discloses a preparation apparatus and preparation method of a polyimide thick membrane or a polyimide ultrathick membrane, which belongs to the technical field of polyimide membranes. The preparation apparatus comprises a shell, wherein a metal plate parallel to the bottom surface of the shell is arranged inside the shell, the interior of the shell is divided by the metal plate intotwo independent heating cavities and a cooling cavity located on the upper portion of the heating cavity, the top of the heating cavity is provided with a heating pipe parallel to the metal plate, twoside surfaces of the cooling cavity are respectively provided with an air inlet and an air outlet, the outer side of the shell is provided with an air blower, the air blower is communicated with thecooling cavity by virtue of the air inlet, and a thermocouple is arranged in the middle of the metal plate. The invention also discloses a method for preparing the polyimide thick membrane or the polyimide ultrathick membrane by using the preparation apparatus. By adopting the preparation apparatus and preparation method, the polyimide thick membrane or polyimide ultrathick membrane with thicknessgreater than 50 micrometers can be prepared; and moreover, the structure is simple, and the operation is easy.

Description

technical field [0001] The invention relates to a preparation device and method for polyimide thick film or polyimide ultra-thick film, belonging to the technical field of polyimide film. Background technique [0002] Polyimide has excellent high temperature resistance, low temperature resistance, good mechanical properties and chemical stability, and small thermal expansion coefficient. It is the polymer material with the best insulation performance in the world. Polyimide membrane materials are widely used in various high-tech fields such as electronics and aviation. [0003] According to the thickness, polyimide film can be classified into ultra-thin film (d≤8μm), conventional thin film (8μm<d≤50μm), thick film (50μm<d≤125μm) and ultra-thick film (d>125μm). The preparation process of polyimide thick film and ultra-thick film is complicated, so the price is much higher than that of polyimide conventional film. [0004] At present, the preparation method of polyi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C41/24C08G73/10C08J5/18
CPCB29C41/24C08G73/10C08J5/18
Inventor 黄思玉黄孙息
Owner GUANGXI NORMAL UNIV
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