36results about How to "No stripping" patented technology

The invention provides an adhesive-free flexible copper-coated board and a fabrication method thereof. The fabrication method comprises the following steps of S1: performing aminopropyl alkoxy silaneand water modification processing on a surface of a copper foil by an atomic layer deposition method to obtain a surface-modified copper foil; S2, depositing a PI film on a surface of the surface-modified copper foil by the atomic layer deposition method; and S3, and performing rapid thermal processing on the PI film deposited in the step S2. The PI thin film prepared by the atomic layer deposition (ALD) method is uniform in film thickness, smooth in appearance and controllable in thickness, the bonding force between the PL thin film and the copper foil is favorable, 2L-FCCL of PI is obtained,and a novel environment-friendly process is provided for manufacturing the 2L-FCCL.

The invention discloses a normal-temperature phosphating fluid for drawing steel. The liquid is prepared by nitrate, nitrite, nitroguanidine, molybdate, phosphate, an accelerant and deionized water. The liquid can be used for performing normal-temperature phosphating on the steel for drawing, and can reach a same effect under a relatively-high-temperature phosphating; under the normal temperature, after 3 to 5 minutes, a layer of black, even and compact phosphating film can be formed on the surface of the steel, and the corrosion resistance is tested to be above the national standard. The problems of large high-temperature phosphating liquid consumption, high possibility in stripping, long phosphating time and the like are solved.

Provided are a polyhedral oligomeric silsesquioxane compound containing mercapto polyfunctional group shown as general formula (1), its composition used for preparing the soft template for imprinting and the imprinting process, wherein R1 is -CH2-CH2-CH2-SH, and m represents the integer of 3 to 12; R2 is unsubstituted or substituted alkyl group, unsubstituted or substituted alkoxy, unsubstituted or substituted ester group, and unsubstituted or substituted aryl group respectively, and the said substituent group is halogen; n represents the integer of 1 to 12. The composition is a high hydrophobic photoresist. When the composition is applied to prepare nanoimprinting template, a high precision structure can be achieved and the recycling rate of the template may be improved.

The invention discloses an insulation stretch resistant coating, a preparation method and an application thereof. The coating comprises the following components of 15-35 parts of a polyester resin A, 5-25 parts of a polyester resin B, 3.5-5 parts of an amino resin, 0-0.5 part of an adhesion promoter, 0.1-0.2 part of a slip additive, 2.5-4 parts of a surface modification agent, 0.1-0.2 part of an antifoaming agent, 0.1-0.2 part of a flatting agent and 50-55 parts of an organic solvent. The method firstly mixing the polyester resin A, the polyester resin B, the amino resin and the organic solvent, and then adding and evenly mixing the adhesion promoter, the surface modification agent, the slip additive, a catalyst, the antifoaming agent and the flatting agent to obtain the insulation stretch resistant coating. The insulation stretch resistant coating is free from yellowing after the coating is roasted for 3 minutes at the temperature of 270 DEG C and capable of resisting high voltage of 1050V; the appearance of a capacitor paint film which is formed by deep-draw is flawless; the paint film is free from dissolution after-tack when soaked in carbon tetrachloride for 2 hours; and the paint film at the position of a notch of the capacitor is free from peeling off and foaming when the capacitor is cooked at the temperature of 100 DEG C for 30 minutes. Accordingly, the coating is wide in application prospect in electronic products.

A process for coloring on the surface of steel band features that the steel band is treated in a heating furnace containing protecting gas at 280-560 deg.C for 2-10 min. Controlling the temp, the flow of protecting gas and time, the yellow, blue, or black color can be obtained.

The invention discloses a non-yellowing capacitor coating at a high temperature having deep drawing resistance performance and a preparation method thereof. The capacitor coating in the invention is prepared from the materials according to the following parts by weight: 20 to 50 parts of hyperbranched polyester resin, 1 to 7 parts of saturated polyester resin, 3 to 12 parts of isocyanate, 0 to 0.5 parts of adhesion promoter, 0 to 0.15 parts of slipping wax, 0 to 0.3 parts of organic tin catalyst, 2.0 to 6.0 parts of resin modifier, 0.07 to 1.0 parts of defoamer, 0.15 to 0.20 parts of flattingagent, and 30 to 62 parts of solvents. The hyperbranched polyester resin, saturated polyester resin and isocyanate are put into a container so as to prepare a mixture after high-speed dispersing; therest of the materials are then put into the mixture so as to mix homogeneously by medium-speed dispersing, thereby obtaining the non-yellowing capacitor coating at a high temperature having deep drawing resistance performance. The capacitor in the invention has the characteristics of deep drawing resistance, good percentage elongation of coating film and no yellowing at a high temperature.

The invention discloses highly corrosion-resistant environment-friendly black phosphatizing liquid without nickel single component. Each liter of the treatment liquid consists of the following raw materials: 25-50g of main film forming agent, 5-25g of film forming aid, 0.1-3g of accelerant, 60-80g of grain refiner, 0.5-2g of stabilizer, 0.05-1g of blackening agent and 0.1-0.5g of blackening aid. The phosphatizing liquid disclosed by the invention can form a black phosphatized film on a steel surface by a one-step process. The phosphatized film has high blackness and high corrosion resistance, is uniform and avoids stripping; a copper sulfate spot test can reach 40min which is much longer than the national standard (2min); the phosphatizing liquid does not contain toxic and harmful substances such as nickel, nitrite and the like and causes little environmental pollution.

The invention discloses a high-speed low-shrink low-smoke zero-halogen tight-buffered material used for a 4G optical cable and a preparation method of the high-speed low-shrink low-smoke zero-halogen tight-buffered material. The tight-buffered material is composed of the following raw materials in parts by weight: 30-60 parts of ethylene-vinyl acetate copolymer, 10-20 parts of linear low density polyethylene, 20-30 parts of high density polyethylene, 10-30 parts of compatilizer, 100-150 parts of filler-type flame retardant, 25-60 parts of synergistic flame retardant, 1-2 parts of silane coupling agent, 2-5 parts of ultra-high molecular weight silicone master batch, 0.5-1 part of amides high-performance lubrication dispersant and 0.2-0.5 part of compound antioxygen through stirring, mixing and extruding steps. The tight-buffered material prepared by elaborate formula selection and processing is low in shrinking percentage, strong in rigidity, high in hardness, high in extrusion molding speed, low in rejection rate and good in high / low temperature cycling resistance. When the tight-buffered material is processed, die orifice stacking and salivation are less, the surface of the optical cable is smooth, fine and particle-free, and the tight-buffered material is easy to peel.

In the surface-coated cutting tool, the hard coating layer includes at least an (Al, Cr, Si, Cu)N layer, which is composed of a main phase, CrSi-rich particles and Al-rich particles dispersed in the main phase. By (Al 1‑α‑β‑γ Cr α Si β Cu γ ) 1‑x N x In the case of the composition of the main phase, CrSi-rich particles and Al-rich particles, the main phase satisfies 0.15≤α≤0.40, 0.05≤β≤0.20, 0.005≤γ≤0.05, 0.45≤x≤0.60, and the The CrSi-rich particles satisfy 0.20≤α≤0.55, 0.20≤β≤0.55, 0≤γ≤0.10, 0.02≤x≤0.35, and the Al-rich particles satisfy 0.10≤α≤0.25, 0.05≤β≤0.25, 0≤γ≤ 0.10, 0.02≤x≤0.35, where α, β, γ, and x are atomic ratios, and the area ratio of CrSi-rich particles in the upper layer cross section when observing particles with a long diameter of 100 nm or more in the upper layer cross section 0.20 area % to 2.0 area %, and the area ratio of the Al-rich particles in the cross section of the upper layer is 0.50 area % to 3.0 area %.