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2results about How to "No stripping" patented technology

A vacuum cup mouth spinning equipment

PendingCN122274044AReduce deflection vibrationImprove spinning accuracy
This invention relates to the field of cup rim spinning technology, and discloses a cup rim spinning device for insulated cups, including a mounting frame, a rotating base, a horizontal plate, a first cylinder, a drive motor, a U-shaped bracket, and a spinning disc mounted on the mounting frame. It also includes a precision spinning mechanism disposed on the horizontal plate, comprising a fixed sleeve, an extrusion shaft slidably disposed within the fixed sleeve, and a pressure plate fixed to the extrusion shaft via a cross-shaped connecting plate. Through the cooperation of the extrusion shaft, pressure plate, pressure cap, first ball bearings, ring plate, and bushing, when the extrusion shaft presses down, the pressure plate and elastic element drive multiple first ball bearings at the bottom of the pressure cap to evenly abut against the ring plate, stably transmitting vertical pressure to the bushing and main shaft. This effectively reduces the deflection vibration of the main shaft during spinning, significantly improves the spinning accuracy of the spinning disc, and solves the problem of poor cup rim forming quality caused by insufficient main shaft accuracy in traditional equipment.
Owner:YONGKANG LONGHE CUP CO LTD

Polyimide composite film and its preparation method

This invention relates to a polyimide composite film, comprising: a carrier layer; a sputtered copper layer laminated to the surface of the carrier layer; an electroplated copper layer laminated to the surface of the sputtered copper layer; and an electroplated tin layer laminated to the surface of the electroplated copper layer. The carrier layer is a polyimide film with a thickness of 5-30 μm, the sputtered copper layer has a thickness of 0.5-2 μm, the electroplated copper layer has a thickness of 2-5 μm, and the electroplated tin layer has a thickness of 1-5 μm. The surface roughness Rz of the electroplated copper layer is 1-3 μm. This invention also relates to a method for preparing the above-mentioned polyimide composite film.
Owner:SHENZHEN RUIXI NEW MATERIAL TECH CO LTD