High-performance thermal-conduction wire and preparation method thereof

A heat-conducting wire and high-performance technology, which is applied in the field of heat-conducting wire with high thermal conductivity and its preparation, can solve problems such as only, graphene application limitations, and satellite space location limitations, and achieve simple production process and good resistance to rapid cooling and rapid heating , Applicable effect

Active Publication Date: 2018-01-19
SOUTH CHINA UNIV OF TECH +1
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, graphene composite thermal conductive materials usually add graphene to resin or polymer as an additive to improve its high thermal conductivity, but its thermal conductivity is often only about 10W / (m·k), making graphene Thermal applications are very limited and limited by satellite spatial location

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-performance thermal-conduction wire and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A heat conduction wire with high thermal conductivity and a preparation method thereof, comprising the following steps:

[0042] Preparation of flexible graphene thermal film: disperse the graphene oxide prepared above into 100ml solution to make the concentration 10mg / ml, add 4.5g surfactant: 3.5g sodium lauryl sulfate and 1.5g stearic acid ; 1.8g wetting agent: 0.9g of DM-56 silane coupling agent and 0.9g of MONENG-1070 leveling agent; adding additives: 3-(trimethoxysilylpropyl) dimethyl octadecyl chloride Ammonium 1.2g; Ultrasound for 2 hours to obtain a uniformly dispersed colloidal solution, use spray coating method or spin coating process to form a film, and control the dry film thickness to 75 μm, and then prepare the prepared graphene-substrate composite heat conduction film in nitrogen or argon. Graphene-substrate composite thermal conductive film was obtained through thermal reduction at 800°C.

[0043] Preparation of the base material: Boil the carbon fiber me...

Embodiment 2

[0055] Preparation of flexible graphene heat conduction film: disperse the graphene oxide prepared above into 100ml solution to make the concentration 15mg / ml, add 5.5g surfactant: 3.5g sodium lauryl sulfate and 2g stearic acid; 2.0g wetting agent: 1.1g of DM-56 silane coupling agent and 0.9g of AKN-3600 fluorocarbon acrylate leveling agent; add additive: 3-(trimethoxysilylpropyl)dimethyloctadecane Ammonium chloride 1.4g; Ultrasound for 2 hours to obtain a uniformly dispersed colloidal solution, use spray coating method or spin coating process to form a film, and control the dry film thickness to 75 μm, and then prepare the graphene-substrate composite heat conduction film in nitrogen Or under the condition of argon, the graphene-substrate composite heat conduction film is obtained through high-temperature thermal reduction at 800 °C.

[0056] Preparation of the base material: Boil the carbon fiber membrane in a mixed solution of sodium bicarbonate with a volume fraction of 2%...

Embodiment 3

[0065] Preparation of flexible graphene heat conduction film: disperse the graphene oxide prepared above into 100ml solution to make the concentration 20mg / ml, add 5.5g surfactant: 3.5g sodium lauryl sulfate and 2g stearic acid; 2.0g wetting agent: including 1.1g of DM-56 silane coupling agent and 0.9g of MONENG-1070 leveling agent; adding additive: 3-(trimethoxysilylpropyl)dimethyloctadecylammonium chloride 1.4g; Ultrasound for 2.5 hours to obtain a uniformly dispersed colloidal solution, use spray coating method or spin coating process to form a film, and control the dry film thickness to 90μm, and then prepare the prepared graphene-substrate composite heat conduction film in nitrogen or argon. Graphene-substrate composite thermal conductive film was obtained through thermal reduction at 1000°C.

[0066] Preparation of the base material: Boil the carbon fiber membrane in a mixed solution of sodium bicarbonate with a volume fraction of 2% for 10 minutes, then wash it with dei...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thermal conductivityaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a high-performance thermal-conduction wire and a preparation method thereof. The thermal-conduction wire is composed of a flexible graphene thermal-conduction film and a base material. The flexible graphene thermal-conduction film is composed of the following raw materials (by weight): 5-30% of graphene oxide, 60-85% of a solvent, 1-5% of a wetting agent, 1-3% of an auxiliary agent, 5-10% of a surfactant and 1-4% of an adhesive. Heat conductivity coefficient of the thermal-conduction wire is 783 W / (m.K) and above. The graphene-composite thermal-conduction wire achieves783 W / (m.K) and above. Equivalent diameter of the thermal-conduction material can be controlled according to requirements. The thermal-conduction wire has good heat-cold resistance and also has characteristics of flexibility, small size and low mass.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to a heat-conducting wire with high thermal conductivity and a preparation method thereof. The heat-conducting wire is mainly used for heat transmission of high-temperature equipment. Background technique [0002] The present invention is aimed at the rapid development of high-integrated high-power electronic equipment, the degree of integration is getting higher and higher, and the size of the chip is continuously reduced, such as the strong development of high-performance microprocessors and other electronic components and their high integration, making it The heat flux has reached 1000W / cm 2 , resulting in a sharp increase in chip heat flux and uneven temperature distribution, causing thermal failure of the chip, affecting its efficient, stable, safe operation and service life. In many fields, weight loss is becoming more and more stringent. For example, for...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B32B9/00B32B9/04B32B7/12
Inventor 李静樊春雷黄敏菊
Owner SOUTH CHINA UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap