A kind of adhesive-free flexible copper clad laminate and preparation method thereof

An adhesive and flexible technology, used in the manufacture of printed circuits, the manufacture of printed circuit precursors, and the improvement of metal adhesion to insulating substrates. , The effect of uniform film thickness

Active Publication Date: 2020-09-29
深圳市藤野电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The self-limiting and surface-terminating growth of ALD can obtain high-quality thin films on large-area substrates and even on deep trench surfaces. Therefore, ALD has also attracted more and more attention in the field of microelectronics industry in recent years. ALD is generally used for the deposition of inorganic compounds, and the deposition temperature is generally as high as 200-500 ° C, while the ALD deposition of organic compounds has not been widely studied.

Method used

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  • A kind of adhesive-free flexible copper clad laminate and preparation method thereof

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preparation example Construction

[0037] The present application provides a method for preparing an adhesive-free flexible copper-clad laminate. In a specific embodiment, it includes the following steps:

[0038] S1: Aminopropylalkoxysilane and water were used to modify the surface of the copper foil by atomic layer deposition to obtain a surface-modified copper foil;

[0039] S2: Depositing a PI film on the surface of the surface-modified copper foil by atomic layer deposition;

[0040] S3: performing rapid heat treatment on the PI film deposited in step S2.

[0041] In some preferred embodiments, at least one of the following conditions may also be preferred:

[0042] Step S1 comprises the following steps:

[0043] S1.1: Place the copper foil in an atomic layer deposition reactor at 120-150°C for pretreatment to remove physically adsorbed water molecules on the surface of the copper foil; the pretreatment time is preferably about 30 minutes;

[0044] S1.2: Deposit aminopropylalkoxysilane on the surface of...

Embodiment 1

[0065] Raw materials:

[0066] Pyromellitic dianhydride (PMDA)

[0067] Diaminodiphenyl ether (ODA)

[0068] Nitrogen (carrier / cleaning gas)

[0069] RA copper foil (thickness: 1 / 2OZ)

[0070] γ-Aminopropyltrimethoxysilane (APTMS)

[0071] steam

[0072] instrument:

[0073] F-120 type ALD reactor (Finland)

[0074] PEO601 RTA rapid thermal annealing furnace (Germany)

[0075] Experimental steps:

[0076] S1: Using the atomic layer deposition method, the surface of the copper foil is subjected to APTMS-H 2 O modification treatment, obtain surface modified copper foil, wherein, copper foil adopts rolling copper foil (RA copper foil), concrete steps are as follows:

[0077] S1.1 Place the copper foil in an ALD reactor at 120-150°C for pretreatment for 30 minutes to remove water molecules physically adsorbed on the surface of the copper foil;

[0078] S1.2 Deposit APTMS by ALD on the surface of copper foil (reaction pressure: 20-50mbar; deposition temperature: 90-130°C;...

Embodiment 2

[0093] The difference from Example 1 is that this example is the ALD deposition of BPDA-ODA type PI on the copper foil surface, and the specific deposition cycle and reaction conditions in step S2 are: BPDA gas pulse (deposition temperature: 170 ° C, pulse Time: 3.0s)-N 2 (Purge time: 1.5-3.0s)-ODA gas pulse (deposition temperature: 150°C, pulse time: 2.0s)-N 2 (Purge time: 1.5-3.0s). All the other are with embodiment 1.

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Abstract

The invention provides an adhesive-free flexible copper-coated board and a fabrication method thereof. The fabrication method comprises the following steps of S1: performing aminopropyl alkoxy silaneand water modification processing on a surface of a copper foil by an atomic layer deposition method to obtain a surface-modified copper foil; S2, depositing a PI film on a surface of the surface-modified copper foil by the atomic layer deposition method; and S3, and performing rapid thermal processing on the PI film deposited in the step S2. The PI thin film prepared by the atomic layer deposition (ALD) method is uniform in film thickness, smooth in appearance and controllable in thickness, the bonding force between the PL thin film and the copper foil is favorable, 2L-FCCL of PI is obtained,and a novel environment-friendly process is provided for manufacturing the 2L-FCCL.

Description

technical field [0001] The invention belongs to the technical field of manufacturing flexible copper-clad laminates, and in particular relates to a preparation method of an adhesive-free flexible copper-clad laminate. Background technique [0002] Polyimide (PI) films have attracted much attention for their excellent high temperature resistance, mechanical strength, and chemical resistance. For example, they can be used as interlayer insulating dielectric materials in the microelectronics industry, or as gate insulating layer. At present, the manufacture of flexible copper clad laminate (Flexible Copper Clad Laminate, FCCL) has become the largest application field of electronic grade PI film. [0003] FCCL is a processing substrate material for flexible printed circuit boards (FPC). Among them, FCCL without adhesive is also called two-layer flexible copper clad laminate (2L-FCCL), which is thin, light, reliable and flexible. The high-end FPC with 2L-FCCL as the substrate m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/02H05K3/38
CPCH05K3/022H05K3/381H05K3/382
Inventor 刘萍张双庆
Owner 深圳市藤野电子科技有限公司
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