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Thermosetting resin composition, prereg, laminated board and printed circuit board

A resin composition and thermosetting technology, applied in the direction of synthetic resin layered products, electronic equipment, layered products, etc., can solve the problems of poor sheet processability, high cost, large amount of use, etc., and achieve improved heat resistance and thermal decomposition. Effect of temperature increase and high heat resistance

Inactive Publication Date: 2018-09-25
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. Use a high heat-resistant hardener, such as phenolic resin instead of dicyandiamide, but this method will cause difficulties in curing and poor processability of the board; and
[0006] 2. Use high heat-resistant epoxy resins, such as biphenyl-type epoxy resins, DCPD (dicyclopentadiene)-type epoxy resins, and phenolic-type multifunctional epoxy resins, but the amount of these high-heat-resistant epoxy resins required big and expensive

Method used

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  • Thermosetting resin composition, prereg, laminated board and printed circuit board
  • Thermosetting resin composition, prereg, laminated board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0098] 100 parts by weight of brominated bisphenol A type epoxy resin (Dow Chemical, epoxy resin equivalent 435, bromine content 19%, product name DER530), 3 parts by weight of dicyandiamide, 0.05 parts by weight of 2-methylimidazole (Shikoku Chemically formed) and 1 part of manganese carbonate are dissolved in N, N-dimethylformamide, and are mixed with 65% by weight of resin glue. Take a flat and clean E-type glass fiber cloth of model 2116 and soak it evenly with the above resin glue at room temperature, and bake it in a blast oven at 155°C for 6 minutes to prepare a prepreg for printed circuits. Eight sheets of the above-mentioned prepregs for printed circuits were stacked, covered with 35 μm copper foil up and down, and pressed in a vacuum hot press for 60 minutes at a pressure of 3 MPa and a temperature of 180° C. to obtain a copper-clad laminate.

Embodiment 2

[0100] 100 parts by weight of brominated bisphenol A type epoxy resin (Dow Chemical, epoxy resin equivalent 435, bromine content 19%, product name DER530), 3 parts by weight of dicyandiamide, 0.05 parts by weight of 2-methylimidazole (Shikoku chemical formation) and 1 part of manganese sulfate are dissolved in N, N-dimethylformamide to prepare 65% by weight resin glue. Take a flat and clean E-type glass fiber cloth of model 2116 and soak it evenly with the above resin glue at room temperature, and bake it in a blast oven at 155°C for 6 minutes to prepare a prepreg for printed circuits. Eight sheets of the above-mentioned prepregs for printed circuits were stacked, covered with 35 μm copper foil up and down, and pressed in a vacuum hot press for 60 minutes at a pressure of 3 MPa and a temperature of 180° C. to obtain a copper-clad laminate.

Embodiment 3

[0102] 100 parts by weight of brominated bisphenol A type epoxy resin (Dow Chemical, epoxy resin equivalent 435, bromine content 19%, product name DER530), 3 parts by weight of dicyandiamide, 0.05 parts by weight of 2-methylimidazole (Shikoku chemical formation) and 1 part of manganese acetate are dissolved in N, N-dimethylformamide to prepare a 65% by weight resin glue. Take a flat and clean E-type glass fiber cloth of model 2116 and soak it evenly with the above resin glue at room temperature, and bake it in a blast oven at 155°C for 6 minutes to prepare a prepreg for printed circuits. Eight sheets of the above-mentioned prepregs for printed circuits were stacked, covered with 35 μm copper foil up and down, and pressed in a vacuum hot press for 60 minutes at a pressure of 3 MPa and a temperature of 180° C. to obtain a copper-clad laminate.

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Abstract

The invention provides a thermosetting resin composition, a prereg, a laminated board and a printed circuit board. The thermosetting resin composition is prepared from brominated epoxy resin, a hardening agent and a heat-resistant modifier, wherein the heat-resistant modifier is a manganese salt, manganese hydroxide or a mixture thereof. The thermosetting resin composition contains the manganese salt and / or the manganese hydroxide, and the thermal decomposition temperature of the thermosetting resin composition is obviously improved, so that the heat resistance is obviously improved. In addition, the copper-coated laminated board manufactured by the thermosetting resin composition with high heat resistance is good in comprehensive property, has high heat resistance and meets the requirements for machining and assembling of the printed circuit board.

Description

technical field [0001] The disclosure relates to a thermosetting resin composition and a prepreg. Specifically, the present disclosure relates to a thermosetting resin composition, a prepreg, a laminate, and a printed circuit board. Background technique [0002] With the rapid development of electronic products towards miniaturization, multi-function, high performance and high reliability, printed circuit boards begin to move towards high precision, high density, high performance, microporous, thin and multilayer The direction of fast manganese development, its application scope is more and more extensive, and it has rapidly entered civilian electrical appliances and related products from industrial large-scale electronic computers, communication instruments, electrical measurement, national defense, aviation, aerospace and other departments. The matrix material largely determines the performance of printed circuit boards, so it is urgent to develop a new generation of matr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/10C08K3/22C08K3/30C08K3/26C08K5/098C08K3/16C08K5/00C08K7/14C08J5/24B32B17/04B32B17/12B32B15/20B32B15/14B32B27/04B32B27/18B32B27/38
CPCB32B5/02B32B5/26B32B15/14B32B15/20B32B2260/021B32B2260/046B32B2262/101B32B2307/306B32B2457/08C08J5/24C08J2363/00C08K3/16C08K3/22C08K3/26C08K3/30C08K5/0091C08K5/098C08K7/14C08K9/10C08K2003/2262C08K2003/3045C08L2201/08C08L63/00
Inventor 邢燕侠柴颂刚
Owner GUANGDONG SHENGYI SCI TECH