Copper alloy bonding wire and manufacturing method thereof

Abstract

A copper alloy bonding wire is characterized in that it contains 0.1-4% by weight of Pd, 1-300 ppm of trace elements, and the balance is copper; the trace elements are Ca, In, Co, Be, Ga, One or a combination of two or more of Mg, Ni, Pt and Al. The present invention also provides a manufacturing method of the above-mentioned copper alloy bonding wire. The copper alloy bonding wire of the present invention has the following beneficial effects: (1) has excellent workability (the lower circuit of the CUP electrode will not break or break down) and reliability; Reliability in thermal shock test; (3) Low wire hardness, HAZ length can be as low as 50 um, which greatly reduces the arc height of wire bonding; (4) Better suppression of copper-aluminum intermetallic compounds; (5) It can provide good bonding, effectively prevent water vapor from infiltrating the interface, and can improve the problem of gold ball falling off in IC high-temperature and high-humidity environments; (6) The cost is low, and there is no electroplating process, which will not cause pollution emissions.

Description

technical field

[0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a copper alloy bonding wire and a manufacturing method thereof. Background technique

[0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Due to the development requirements of miniaturization and thinning of electronic products, the sem...

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