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Solder paste for low-temperature soldering and preparation method thereof

A technology of solder paste and solder, which is applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problem of high brazing temperature, and achieve the effect of avoiding corrosion and deformation

Active Publication Date: 2022-03-08
SUZHOU ZUENS IOT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The solder paste for soft soldering in the prior art has a brazing temperature higher than 450°C and belongs to the field of hard soldering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0034] Embodiment: A kind of solder paste for low-temperature soldering, the soldering temperature of the solder paste is less than or equal to 180°C, the solder paste includes solder and flux, based on the total weight percentage of the solder paste, wherein the solder is 60-80%, the flux is 20-40%, the solder is a metal powder with a melting point lower than 180°C, the metal powder includes at least one of single metal powder and alloy powder, and the flux is It includes by weight: 40-50% of organic amine and amino alcohol additives, 45-50% of alcohol additives and 5-10% of halogen salt additives.

[0035] An embodiment of the solder paste is: 79% of the solder, 21% of the solder flux; another embodiment of the solder paste is 60% of the solder, and 40% of the solder flux; the solder paste Another example is that the solder is 70%, and the flux is 30%.

[0036]One embodiment of the flux is: organic amine and amino alcohol combined 40% of additives, 50% of alcohol additives ...

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PUM

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Abstract

The invention discloses a solder paste for low-temperature soldering. The soldering temperature of the solder paste is less than or equal to 180° C. The solder paste includes solder and flux, and is calculated according to the total weight percentage of the solder paste, wherein the solder is 60-80%, The flux is 20-40%, and the solder is metal powder with a melting point lower than 180°C. The metal powder includes at least one of single metal powder and alloy powder. The flux includes, by weight, organic amine and amino alcohol combined. 40-50% of auxiliaries, 45-50% of alcohol auxiliaries and 5-10% of halogen salt auxiliaries. The invention has suitable viscosity and rheology, is easy to coat on the parts that need to be connected, the paste is stable, it is not easy to settle and delaminate, the corrosion resistance of the brazed joint is strong, and the air is isolated during welding, and the aluminum oxide layer is avoided to be removed. Re-oxidized by oxygen in the air or reacted with water vapor; most of the flux will evaporate or sublime to avoid the corrosion of aluminum foil and chip by residual flux, especially suitable for RFID aluminum antenna welding or chip mounting on aluminum antenna When the aluminum antenna is soldered with the chip pins.

Description

technical field [0001] The invention belongs to the technical field of soldering paste for soldering and its preparation, and in particular relates to a soldering paste for low-temperature soft lead soldering, especially suitable for aluminum antennas and chip leads when soldering RFID aluminum antennas or mounting chips on aluminum antennas. The feet are soldered. Background technique [0002] Brazing is a common method of connecting aluminum-aluminum and aluminum-copper in electronic technology. It is usually divided into two types: hard brazing and soft brazing: with the brazing temperature of 450°C as the boundary, the process higher than this temperature It is called brazing, and lower than this temperature is called soft soldering. Among them, brazing has great limitations in the connection process of some electronic and electrical products due to the high process temperature; soft soldering The brazing temperature is low, and the heat effect of the brazing process on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/264B23K35/3603B23K35/3615
Inventor 张金松陆凤生
Owner SUZHOU ZUENS IOT TECH CO LTD