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Nano silver wire conductive structure for wearable device and preparation method thereof

A nano-silver wire, conductive structure technology, applied in nanotechnology for material and surface science, conductive layer on insulating carrier, nanotechnology and other directions, can solve different problems, achieve improved conductivity, simple manufacturing process, The effect of novel technology

Inactive Publication Date: 2018-10-12
佛山市瑞联福电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no technology for preparing conductive structures with silver nanowires combined with non-transparent substrates. Since the applicable scenarios of non-transparent substrates are different from those of transparent substrates, there will be great differences in structure preparation and material selection.

Method used

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  • Nano silver wire conductive structure for wearable device and preparation method thereof

Examples

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Embodiment 1

[0047] The invention provides a nano-silver wire conductive structure for wearable devices, such as figure 1 As shown, it includes a cloth 1 as a non-transparent substrate, a flexible adhesion layer 2, and a conductive layer 3 that are sequentially stacked from bottom to top. The conductive layer includes a nano-silver wire layer 31 and a surface covering layer 32. The nano-silver The wire layer is embedded in the surface covering layer.

[0048] The above are the basic embodiments of the present invention. Through the technical solution, a nano-silver wire conductive structure that can be applied to wearable devices can be prepared.

[0049] In this embodiment, cloth is selected as the non-transparent substrate shown, and in other preferred implementation manners, the non-transparent substrate may also be knitted fabric or cotton.

[0050] In this embodiment, the surface of the non-transparent substrate is uneven. In other embodiments, the non-transparent substrate can also...

Embodiment 2

[0056] This embodiment is an example of combining some implementation modes above the basic implementation mode in the above-mentioned Example 1, and the following implementation modes may be implemented independently in combination with the basic implementation mode, or may be implemented in combination with other implementation modes.

[0057] In some embodiments, the thickness of the silver nano wire layer is in the range of 20-10000 nm. Compared with the silver nano wire conductive structure based on transparent substrates, the light transmittance of the silver nano wire layer needs to be considered and the thickness of the silver nano wire layer needs to be reduced, thereby inevitably sacrificing the electrical conductivity. This solution is based on a non-transparent substrate The nano-silver wire conductive structure does not need to care about the light transmittance, so in order to achieve lower square resistance and better conductivity, the present invention can be re...

Embodiment 3

[0062] This embodiment provides a method for preparing the above-mentioned silver nanowire conductive structure, the method comprising the following steps:

[0063] S1: selecting a non-transparent substrate, and cleaning the non-transparent substrate;

[0064] S2: coating the pre-prepared resin solution on the non-transparent substrate, and then drying to form a flexible adhesion layer;

[0065] S3: uniformly coating the nano-silver wire solution on the structure obtained in S2, and then drying the obtained structure;

[0066] S4: coating the surface covering layer solution on the structure obtained in S3, and then drying it to finally make a silver nanowire conductive structure.

[0067] In some preferred embodiments, the manner of cleaning the non-transparent substrate is plasma cleaning. Plasma cleaning can not only clean the dirt on the surface of the substrate, but also improve the surface wetting ability of the substrate, so that the coating effect of the subsequent coat...

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Abstract

The invention discloses a nano silver wire conductive structure for a wearable device and a preparation method thereof. The nano silver wire conductive structure comprises a non-transparent substrate,a flexible adhesion layer and a conductive layer laminated in order from bottom to top, the conductive layer comprises a nano silver wire layer and a surface covering layer, and the nano silver wirelayer is embedded in the the surface covering layer. The method comprises: washing the non-transparent substrate; coating a resin solution on the non-transparent substrate and drying to form a flexible adhesive layer; uniformly coating the nano silver wire solution on the obtained structure and then drying; coating the surface coating solution on the resulting structure and then drying to finallyform a nano silver wire conductive structure. Through the technical solution, the nano silver wire may be applied to a wearable device of a non-transparent substrate, so that the non-transparent substrate has the advantages of high electrical conductivity, mechanical flexibility and stable chemical property, and has good market and economic prospects.

Description

technical field [0001] The invention relates to the field of optical conduction, in particular to a nano-silver wire conductive structure used in wearable devices, and further, to a method for preparing the structure. Background technique [0002] The following statements merely provide background information related to the present disclosure and do not necessarily constitute prior art. [0003] At present, it is common to use nano silver wires to prepare conductive structures. In related structures, a transparent substrate is usually used to make a conductive film, which is used in conjunction with a display screen such as an LCD or OLED. For example, our commonly used smartphone is a typical example of touch screen + LCD (OLED). Among them, the touch screen is on the surface, and the LCD (OLED) is under the touch screen. The fingers of the human body directly touch the touch screen to transmit commands to the mobile phone. The image on the LCD (OLED) changes, and the lig...

Claims

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Application Information

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IPC IPC(8): H01B5/14H01B1/02H01B13/00B82Y30/00
CPCH01B5/14B82Y30/00H01B1/02H01B13/00
Inventor 胡永能高峰周虎陈法波
Owner 佛山市瑞联福电子科技有限公司