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Porous heating component and production method thereof

A technology of porous heating and manufacturing method, applied in the direction of electrical components, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problems of conductive lines falling off, and achieve the effect of overcoming easy falling off when heating, solving easy falling off and prolonging life.

Inactive Publication Date: 2018-10-16
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to overcome the deficiencies of the prior art, and propose a porous heating assembly and its manufacturing method, by printing a glass circuit between the conductive circuit and the surface of the porous material to achieve the purpose of firmly combining the conductive circuit with the surface of the porous material , to solve the problem that the conductive line is easy to fall off the surface of the porous material during the heating process

Method used

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  • Porous heating component and production method thereof
  • Porous heating component and production method thereof
  • Porous heating component and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 1.1. Take the prepared 500-mesh steel mesh, use borosilicate glass paste as raw material, and use silk screen printing to directly print the first glass line on the surface of the porous alumina ceramic material, and then in the mesh belt sintering furnace, under the air atmosphere Carry out sintering, the sintering temperature is 850°C, and the holding time is 15min. After being out of the furnace, a porous plate sample with a densified first glass line is obtained;

[0025] 1.2. Using the same printed screen (equivalent to a mask), print a conductive pattern (using silver paste) on the porous plate sample made in the above 1.1, and then sinter in a mesh belt sintering furnace under an air atmosphere. The temperature is 850°C, and the holding time is 30 minutes. After being out of the furnace, a porous plate sample with a densified conductive heating circuit and a glass circuit is obtained;

[0026] 1.3. Take the porous plate sample obtained in the above 1.2, and use a...

Embodiment 2

[0028] 2.1. Take the prepared 500-mesh expanded metal mesh, use borosilicate glass slurry as raw material, and use silk screen printing to directly print the first glass line on the surface of the porous silicon carbide ceramic material, and then sinter the mesh belt in the sintering furnace under air atmosphere Carry out sintering, the sintering temperature is 850°C, and the holding time is 15min. After being out of the furnace, a porous plate sample with a densified first glass line is obtained;

[0029] 2.2. Using the same printing screen (equivalent to a mask), print a conductive pattern (using Ag 9 PD 1 Conductive paste), and then sintered in a mesh belt sintering furnace under an air atmosphere, the sintering temperature is 850 ° C, and the holding time is 30 minutes. After the furnace is released, a porous plate sample with a densified conductive heating circuit and a glass circuit is obtained;

[0030] 2.3. Take the porous plate sample obtained in the above 2.2, and u...

Embodiment 3

[0032] 3.1. Take the prepared 500-mesh steel mesh, use aluminosilicate glass paste as raw material, and use silk screen printing to directly print the first glass line on the surface of the porous cordierite material, and then carry out the process in the mesh belt sintering furnace under air atmosphere. Sintering, the sintering temperature is 860°C, the holding time is 15min, and the porous plate sample with the first densified glass circuit is obtained after being out of the furnace;

[0033] 3.2. Using the same printed screen (equivalent to a mask), print a conductive pattern (using silver-platinum paste) on the porous plate sample made in the above 3.1, and then sinter it in a mesh belt sintering furnace under an air atmosphere. The sintering temperature is 860°C, and the holding time is 30 minutes. After being out of the furnace, a porous plate sample with a densified conductive heating circuit and a glass circuit is obtained;

[0034] 3.3. Take the porous plate sample ob...

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Abstract

The invention discloses a porous heating component and a production method thereof. The production method comprises the steps of printing first glass lines on the surface of a porous material substrate and then sintering; printing conductive heating lines on the surfaces of the first glass lines and then sintering; and finally covering the surfaces of the conductive heating lines with second glasslines and sintering again to obtain the porous heating component, wherein electric connection ends of the conductive heating lines of the porous heating component are led out through openings in thesecond glass lines. According to the porous heating component, glass layers in the lines on the surface of the porous material are capable of relatively well fixing the conductive lines on the surfaceof the porous material and preventing the damage to the lines caused by local overheating, thereby significantly prolonging the service life when the lines on the surface are electrified and heated.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuits on the surface of porous materials, in particular to a porous heating component and a manufacturing method thereof. Background technique [0002] Porous materials, such as porous ceramics, have holes and roughness on the surface. When the circuit is printed directly on the surface, it is easy to cause poor bonding between the circuit and the porous material at the surface defect of the material. disconnected, causing the line to be disconnected, making it impossible to continue to work with power. [0003] The disclosure of the above background technical content is only used to assist in understanding the inventive concepts and technical solutions of the present invention, and it does not necessarily belong to the prior art of this patent application. There is no clear evidence that the above content has been disclosed before the filing date of this patent application. Under the circ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10H05K3/38
CPCH05K3/388H05K3/103
Inventor 李波戴春雷李可王其艮
Owner SHENZHEN SUNLORD ELECTRONICS