Conducting circuit manufacturing technology for chip
A conductive circuit and manufacturing process technology, applied in the field of conductive circuit manufacturing process of chips, can solve problems such as large pressure difference, uniformity of electroplating metal layer, affecting process uniformity, etc., so as to improve uniformity, effect and efficiency. Effect
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[0029] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0030] Such as Figure 1 to Figure 5 As shown, a conductive circuit manufacturing process of a chip according to the present invention, the process comprises the following steps:
[0031] Step 1: Grinding and thinning the wafer to a set size thickness;
[0032] Step 2: After grinding the wafer to a qualified size in step 1, put the wafer into a plasma etching machine, etch away the area to be etched on the back of the wafer to form a groove, exposing the conductive block on the front of the wafer ;
[0033] Step 3: After step 2 is completed, coat the polymer material on the back of the wafer to form an insulating layer and then bake;
[0034] Step 4: Break down the insulating layer and the conductive block that have been formed on the back of t...
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