Heat pipe backboard type data center

A data center and backplane-type technology, applied in the field of heat pipe backplane-type data centers, can solve the problems of complex control system, difficult control of air-conditioning system pipeline load and refrigerant flow, and less obvious energy-saving effect of heat dissipation information computer room, etc. , to achieve the effect of reduced fan power, small footprint, and increased heat transfer efficiency
CN108770320APending Publication Date: 2018-11-06BEIJING FULLLINK OREITH TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BEIJING FULLLINK OREITH TECH CO LTD
Publication Date
2018-11-06

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Abstract

The invention provides a heat pipe backboard type data center. The data center comprises a plurality of cabinets, a plurality of backboard air conditioners, and a plurality of fans, wherein the numberof the backboard air conditioners is identical to the number of the cabinets; the cabinets are arranged in a front row and a back row to form cabinet groups, and a front-row cabinet group and a rear-row cabinet group are arranged side by side; each backboard air conditioner is mounted on a rear door of the corresponding cabinet; the front-row cabinet group and the rear-row cabinet group are arranged back to back, so that a cooling passage is formed between the front-row cabinet group and the rear-row cabinet group; a closing cover top is mounted at the top of the cooling passage; a pluralityof fan mounting openings are formed in the closing cover top; and the fans are respectively mounted on the fan mounting openings in the sealing cover top. Therefore, the backboard air conditioners aremounted on the rear doors of the cabinets, hot air blown from the cabinets is directly cooled through heat exchangers of the backboard air conditioners, and cooled air enters the cooling passage andis sent to a surrounding environment through suction of the fans, so that cooler air flows that are exhausted from the cabinets can be recycled into the cabinets for cooling of electronic equipment.
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Description

technical field

[0001] The invention relates to the field of data centers, in particular to a heat pipe backplane data center. Background technique

[0002] In recent years, there have been two major issues in data center heat dissipation: heat dissipation in high heat density situations and how to achieve energy-saving operation of data centers.

[0003] In terms of high heat density: In recent years, with the development of data centers, the heat density of a single cabinet in the data center has become higher and higher, reaching 20kW / cabinet, or even higher. It is already very difficult to use traditional direct expansion air conditioners or chilled water machine room air conditioners. It is difficult to solve the heat dissipation problem of this kind of high heat density computer room, and it is easy to generate hot spots locally.

[0004] In terms of energy consumption, with the development of data centers, the greater the heat, the greater the air volume. The existin...

Claims

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