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Lead-free solder alloy, preparation method and application thereof, glass assembly

A lead-free solder alloy and alloy technology, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve problems such as large welding stress, irreversible stress, glass breakage, etc., and achieve small welding stress and excellent performance Superior, Inexpensive Effects

Active Publication Date: 2021-04-16
SAIC GENERAL MOTORS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Known lead-free solder alloys, such as high-tin lead-free solders, are especially unsuitable for application on glass; on the one hand, these lead-free solder alloys cannot obtain high adhesive strength; Poor plastic deformation characteristics, easy to produce large welding stress, for example, glass and similar copper tongues are two materials with a large difference in thermal expansion coefficient, after lead-free solder alloys weld the glass and the connectors of electronic components together , in the subsequent cooling process, due to the poor plastic deformation of the solder, it cannot offset the stress generated between the connectors of the electronic components and the glass, thus generating soldering stress, which under relatively large temperature fluctuations Welding stress can cause glass to crack

Method used

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  • Lead-free solder alloy, preparation method and application thereof, glass assembly
  • Lead-free solder alloy, preparation method and application thereof, glass assembly
  • Lead-free solder alloy, preparation method and application thereof, glass assembly

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Embodiment 1

[0058] The components and mass percentages of the lead-free solder alloy of this embodiment are: indium In: 61%, silver Ag: 4.5%, copper Cu: 0.8%, titanium Ti: 0.5%, and the balance is tin and unavoidable impurities .

[0059] The melting point or liquidus temperature of the above composition is 127.24°C, the solidus temperature is 117.64°C, the tensile strength is 34778 PSI, and the Rockwell hardness is 55.

Embodiment 2

[0061] The components and mass percentages of the lead-free solder alloy of this embodiment are: In: 61.8%, silver Ag: 5%, copper Cu: 1.2%, titanium Ti: 1.1%, bismuth Bi: 1.5%, and the balance is tin and unavoidable impurities.

[0062] The melting point or liquidus temperature of the above composition is 133.18°C, the solidus temperature is 121.94°C, the tensile strength is 34791 PSI, and the Rockwell hardness is 55.5.

Embodiment 3

[0064] The components and mass percentages of the lead-free solder alloy of this embodiment are: In: 63%, silver Ag: 7%, copper Cu: 2.2%, titanium Ti: 2.8%, bismuth Bi: 0.5%, cobalt Co: 1.5% %, the balance is tin and unavoidable impurities.

[0065] The melting point or liquidus temperature of the above composition is 138.82°C, the solidus temperature is 127.40°C, the tensile strength is 34812 PSI, and the Rockwell hardness is 56.2.

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Abstract

The invention provides a lead-free solder alloy, which belongs to the technical field of solder alloys. The components and mass percentages of the lead-free solder alloy are indium In: 60%-64%, silver Ag: 3.65%-7.35%, copper Cu: 0.01% to 5%, titanium Ti: 0.03% to 4%, and the balance is tin Sn. The lead-free solder alloy of the invention has superior performance in terms of strength and ductility, and has low welding stress, and is especially suitable for welding applications on glass.

Description

technical field [0001] The invention belongs to the technical field of lead-free solder, and relates to a lead-free solder alloy, a preparation method and application thereof, and a glass component using the lead-free solder alloy. Background technique [0002] Lead solder has the advantages of good solder diffusion, low melting point, and low price during soldering. However, due to regulations such as EU 2002 / 95 / EG, the solder used in electronic components and electronic connectors in the vehicle is sensitive to lead, mercury, Hazardous substances such as cadmium and chromium have clear restrictions; South Korea has also promulgated similar regulations, and the United States and Japan are also following up. Therefore, it has become a trend to replace lead solder with lead-free solder. [0003] Known lead-free solder alloys, such as high-tin lead-free solders, are especially unsuitable for application on glass; on the one hand, these lead-free solder alloys cannot obtain hi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/40B23K101/38
CPCB23K35/0227B23K35/26B23K35/40
Inventor 葛文杰杨俊隋华王薇彭军桥
Owner SAIC GENERAL MOTORS
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