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Die bonding method for integrated circuit chip

An integrated circuit and die-bonding technology, applied in the field of die-bonding of integrated circuit chips, can solve the problems of chip shedding, low die-bonding speed, poor precision, etc., achieve reliable pick and place, achieve perfect combination, and achieve production efficiency and high Effect of quality level

Inactive Publication Date: 2018-11-13
安徽先捷电子股份有限公司
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AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a method for bonding integrated circuit chips, which aims to solve the problems of low bonding speed, chip falling off, and poor precision in chip bonding in the prior art, so as to ensure that the chip Bonding accuracy, reliability and high efficiency provide a guarantee basis for subsequent wire bonding quality and efficiency

Method used

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Embodiment Construction

[0025] A crystal bonding method for an integrated circuit chip of the present invention will be further described below in conjunction with an embodiment.

[0026] In this embodiment, the crystal bonding method of integrated circuit chips is analyzed in combination with chip bonding equipment. The machine motion control, glue dispensing, chip pick-and-place mechanism and image recognition system cooperate with each other to ensure high-speed, precise and reliable pick-up and placement of chips for chip bonding.

[0027] The present invention provides a kind of solid crystal method that is used for integrated circuit chip, and the specific steps of this method are as follows:

[0028] Step 1, perform material retrieving, the solid crystal clamping mechanism is driven by the first stepping motor, and moves relatively horizontally at a uniform speed to the top of the material workbench where the lead frame is placed, and driven by the second stepping motor, the material The work...

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Abstract

The present invention provides a die bonding method for an integrated circuit chip. Compared with the prior art, the method realizes a high-precision rapid die bonding technology through performing amaterial feeding step, an adhesive dispensing step, a die bonding step and other steps on the basis of the cooperation of die bonding movement control, adhesive dispensing and chip pick-and-place mechanism and an image recognition system. The die bonding method is applicable to a wide application range, for example, the epoxy package of scattered small chips and the die bonding of large chips of integrated circuits. Compared with a chip bonding method adopting eutectic bonding and low-temperature eutectic bonding, the die bonding method of the invention can pick up and place chips at a higherspeed more accurately and reliably, and achieve a balance between production efficiency and high quality level.

Description

technical field [0001] The invention belongs to the technical field of semiconductor integrated circuit packaging, and in particular relates to a crystal-bonding method for integrated circuit chips. Background technique [0002] The rapid development of modern electronic information technology has put forward higher and higher requirements for the miniaturization, portability, multi-function, high reliability and low cost of electronic products; at present, in order to meet the requirements of various electronic products, electronic packaging has been Gradually get rid of the subordinate status as a post-manufacturing process of microelectronics and become relatively independent. In response to the special requirements of various electronic products, a variety of packaging technologies have been developed, and a large number of new theories, new materials, new processes, new equipment and equipment have emerged. New electronic products; Electronic packaging and testing techn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50
CPCH01L21/50
Inventor 郑烽
Owner 安徽先捷电子股份有限公司
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