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A method for improving energy uniformity in a direct-write lithography machine

A technology of uniform energy and lithography machine, applied in the direction of optomechanical equipment, microlithography exposure equipment, optics, etc., can solve problems such as unreachable, poor local resolution, high equipment production costs, etc., to improve process capability, Reduce the effect of poor optical uniformity and improve equipment production yield

Active Publication Date: 2020-09-25
JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This requires that the spatial light modulator (Spatial Light Modulator, SLM) and optical imaging lens used in the direct writing lithography machine need to have higher optical uniformity, otherwise it will cause CDU failure due to energy unevenness, Even in the case of poor partial resolution, the CDU requirement of ±10% cannot be met
The direct solution to improve the uniformity of optical imaging is to use better optical lenses and adopt a stricter assembly process, but this will inevitably lead to higher equipment production costs

Method used

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  • A method for improving energy uniformity in a direct-write lithography machine
  • A method for improving energy uniformity in a direct-write lithography machine
  • A method for improving energy uniformity in a direct-write lithography machine

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Embodiment 1

[0030] This embodiment provides a method for improving energy uniformity in a direct-writing lithography machine. The method includes: dividing the exposure energy of the direct-writing lithography machine for one actual exposure into N parts, and performing exposure in N times ; where N≥2.

[0031] In practical applications, the number of exposures N to be used is determined according to the exposure effect obtained by the direct-writing lithography machine for only one actual exposure. For example, if only one actual exposure is performed, the exposure effect is If the CD value is larger than the CD value on the other side, and its CDU exceeds the standard value, the exposure energy of one actual exposure can be divided into two parts, and the two sides of the graph with the CDU exceeding the standard value can be exposed separately, then only one time can be solved. The CDU caused by exposure exceeds the standard value.

Embodiment 2

[0033] This embodiment provides a method for improving energy uniformity in a direct-write lithography machine, see Figure 1 to Figure 9 , the method includes:

[0034] Divide the exposure energy of the direct-write lithography machine for one actual exposure into N parts, and perform exposure in N times; where N≥2.

[0035] Each exposure energy W1=W / N+△W in N exposures, where W is the exposure energy of the direct-write lithography machine for one actual exposure, △W is the energy fine-tuning value, and △W can be positive or negative value, or zero.

[0036] During the N times of exposure, after each exposure, half an exposure field + M*1 / 2 pixels of exposure start dislocation is carried out in the X direction, or the Y direction, or the XY direction as the starting position of the next exposure , where M is the number of pixels in the exposure process, and M takes an integer value.

[0037] The energy fine-tuning value ΔW is set to 0 at the first exposure. The value of ...

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Abstract

The invention discloses a method for improving the energy uniformity in a direct writing type lithography machine, and belongs to the technical field of printed circuit boards. In the direct writing type lithography machine, multi-exposure scanning technology is adopted, after each exposure, the initial misalignment of exposure of half exposure field+M*1 / 2 pixel in the X direction or the Y direction or the XY direction is performed to be used as an initial position of next exposure, micro-mirrors at different distribution positions on a DMD are used for each exposure, and different light uniformity effects at different positions in the whole view field of the DMD are integrated, and the final exposure effect achieves consistent uniformity. The method can effectively reduce the unqualifiedand unsatisfactory conditions of CDU caused by poor optical uniformity, and improves the processing capacity and yield rate of equipment without increasing the hardware cost.

Description

technical field [0001] The invention relates to a method for improving energy uniformity in a direct-writing photolithography machine, and belongs to the technical field of printed circuit boards. Background technique [0002] Direct writing lithography equipment, also known as laser direct imaging (LDI), is a key equipment in the field of semiconductor and printed circuit board (Printed Circuit Board, PCB) production. In recent years, with the increasingly stringent process requirements in the semiconductor and PCB manufacturing fields, as well as the direct imaging requirements of high-density interconnect (High Density Interconnector, HDI) and integrated circuit (integrated circuit, IC) substrates, direct write The imaging quality of lithography machines also has higher requirements. [0003] In the semiconductor or PCB manufacturing process, as the line width CD gradually develops towards refinement, the requirements for the line width tolerance CDU are also getting hig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70358G03F7/70383
Inventor 陈海巍
Owner JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD