Etching method by using which position and size can be controlled precisely

Abstract

The invention relates to the technical field of micro / nano processing, more specifically, the invention relates to an etching method by using which position and size can be controlled precisely, at first, two templates are provided, and then the corresponding template is manufactured according to the chip shape and thickness, the required etching position and the etching shape, and then the template and the chip are loaded into a liquid pool, and then the etching liquid is injected into the liquid pool for etching, and finally the chip is cleaned and dried to obtain the required chip after precise etching. The invention solves the problems of difficult positioning in the etching process, inability to etch a specific size and shape at a specific position, low etching efficiency and high etching cost. According to the invention, etching can be performed on single-layer or multi-layer composite chips with different shapes and sizes, different thicknesses and different materials. When different chips are used for etching, the template and the liquid pool can be assembled and used only by simple machining. The invention not only realizes the precise positioning of the chip, but also realizes the precise etching of the required size and shape of the required position, and the manufacturing method is simple, high-efficient and wide in application range.

Description

technical field [0001] The present invention relates to the technical field of micro-nano processing, and more specifically, to an etching method with precise and controllable position and size. Background technique [0002] In the past ten years, the use of etching methods to process chips has been one of the important means of material processing. Silicon wafer lithography generally needs to go through a series of steps such as base film treatment, glue coating, pre-baking, alignment and exposure, development, post-development inspection, film hardening, etching, and glue removal. The process is cumbersome and takes a lot of time. With the continuous development of micro-nano processing technology, people's requirements for etching precision continue to increase, and higher requirements are put forward for etching position, etching shape and size. Existing etching methods and devices cannot meet the required position accuracy and required etching size and shape requiremen...

AI Technical Summary

Problems solved by technology

Existing etching methods and devices cannot meet the required position accuracy and required etching size and shape requirements

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