Unlock instant, AI-driven research and patent intelligence for your innovation.

MEMS microphone

A technology of microphones and ASIC circuits, applied in microphone structure associations, loudspeakers, diaphragm structures, etc., can solve problems such as adverse air circulation, reduce the mechanical sensitivity of the diaphragm, limit the high signal-to-noise ratio performance of the microphone, etc. Noise ratio, overall size reduction, reliability enhancement effect

Active Publication Date: 2018-11-30
WEIFANG GOERTEK MICROELECTRONICS CO LTD +1
View PDF6 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This limits the design of the minimum package size of the MEMS microphone (>3mm 3 )
[0004] This is because if the volume of the rear cavity is too small, it is not conducive to the circulation of air, and the rigidity of this air will greatly reduce the mechanical sensitivity of the diaphragm
In addition, for pressure equalization, dense through-holes are usually designed on the back plate, and the air flow resistance in the gap or perforation caused by air viscosity becomes the dominant factor of MEMS microphone noise, thus limiting the high signal-to-noise ratio performance of the microphone

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • MEMS microphone
  • MEMS microphone
  • MEMS microphone

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] In order to make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects obtained easy to understand, the specific implementation manners of the present invention will be further described below in conjunction with the specific drawings.

[0029] refer to figure 1 , the present invention provides a MEMS microphone, which includes a first substrate 1 and a diaphragm 2 supported above the first substrate 1 by a spacer 3, the first substrate 1, the spacer 3, and the diaphragm 2 are surrounded by Vacuum chamber 4 is provided.

[0030] The first substrate 1 of the present invention can be made of single crystal silicon or other materials well known to those skilled in the art, and the spacer 3 can be formed by layer-by-layer deposition, patterning, and sacrificial processes, and the spacer 3 can be supported on the first substrate. The diaphragm 2 on the substrate 1 and the vacuum cavity 4 can be sealed by, for exam...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a MEMS microphone. The MEMS microphone comprises a first substrate and a vibrating diaphragm supported above the first substrate through an interval part, the first substrate,the interval part and the vibrating diaphragm form a vacuum cavity; the static deflection distance of the vibrating diaphragm under the atmosphere pressure is less than the distance between the vibrating diaphragm and the first substrate; a magnetic film is arranged on one of the vibrating diaphragm and the first substrate, and a reluctance sensor matched with a magnetic film on the other one; thereluctance sensor is configured to sense magnetic field change of the magnetic film in the vibration process of the vibrating diaphragm, thereby outputting the changed electric signal. Through the MEMS microphone disclosed by the invention, the signal to noise ratio of the microphone is improved, and the whole size of the MEMS microphone is greatly reduced.

Description

technical field [0001] The present invention relates to the field of acoustic-electric conversion, more specifically, to a mechanism of a MEMS microphone, especially a microphone structure with high SNR. Background technique [0002] The current mainstream MEMS microphones all adopt a capacitive sensing structure, including a substrate, a back plate and a diaphragm formed on the substrate, and there is a gap between the back plate and the diaphragm, so that the back plate and the diaphragm form a A planar capacitive sensing structure. [0003] In order to take full advantage of the mechanical sensitivity of the diaphragm, the microphone needs to be designed with a large back cavity with ambient pressure to ensure the rigidity of the flowing air far from the diaphragm. The volume of the dorsal cavity is usually much greater than 1mm 3 , such as usually designed for 1-15mm 3 . Moreover, when the microphone chip is packaged, its cavity needs to be opened. This limits the d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H04R19/04
CPCH04R19/04H04R1/04H04R7/10H04R7/18H04R23/00H04R31/00H04R2201/003H04R2410/03
Inventor 邹泉波冷群文王喆
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD