Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible piezoelectric composite film and preparation method thereof

A composite film, flexible piezoelectric technology, applied in the direction of coating, etc., to achieve uniform and stable stretching, uniform force, and reduce the chance of damage and wrinkles

Inactive Publication Date: 2018-12-07
SOUTHWEAT UNIV OF SCI & TECH
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems existing in the existing flexible piezoelectric composite film, the present invention provides a flexible piezoelectric composite film and a preparation method thereof, the technical scheme of which is as follows:

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible piezoelectric composite film and preparation method thereof
  • Flexible piezoelectric composite film and preparation method thereof
  • Flexible piezoelectric composite film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The preparation method of the flexible piezoelectric composite film of this embodiment includes:

[0040] (1) Nano-SiO 2 The particles were dissolved in DMF solvent and dispersed ultrasonically, then added PVDF powder and mechanically stirred evenly to obtain SiO 2 / PVDF mixed solution; wherein, the mass ratio of PVDF powder to DMF solvent is 1:5, nano-SiO 2 Particles account for 1% of the mass of PVDF powder;

[0041] Preferably, the power of ultrasonic dispersion is 700W, and the time of ultrasonic dispersion is 40min; the stirring speed of mechanical stirring is 1800rpm, and the stirring time is 40min.

[0042] (2) SiO obtained in step (1) 2 The / PVDF mixed solution is subjected to defoaming treatment, then poured into a mold and placed in a ventilated environment on a constant temperature platform at 75°C for 3 hours to obtain the first composite film;

[0043] (3) The first composite film is taken out from the mold and subjected to hot-pressing treatment. The h...

Embodiment 2

[0052] The preparation method of the flexible piezoelectric composite film of this embodiment includes:

[0053] (1) Nano-SiO 2 The particles were dissolved in DMF solvent and dispersed ultrasonically, then added PVDF powder and mechanically stirred evenly to obtain SiO 2 / PVDF mixed solution; wherein, the mass ratio of PVDF powder to DMF solvent is 1:8, nano-SiO 2 The particles account for 10% of the PVDF powder mass;

[0054] Preferably, the power of ultrasonic dispersion is 800W, and the time of ultrasonic dispersion is 20min; the stirring speed of mechanical stirring is 2200rpm, and the stirring time is 20min.

[0055] (2) SiO obtained in step (1) 2 The / PVDF mixed solution is subjected to defoaming treatment, then poured into a mold and placed in a ventilated environment on a constant temperature platform at 85°C for 2 hours to obtain the first composite film;

[0056] (3) The first composite film is taken out from the mold and subjected to hot-pressing treatment. The...

Embodiment 3

[0065] The preparation method of the flexible piezoelectric composite film of this embodiment includes:

[0066] (1) Nano-SiO 2 The particles were dissolved in DMF solvent and dispersed ultrasonically, then added PVDF powder and mechanically stirred evenly to obtain SiO 2 / PVDF mixed solution; wherein, the mass ratio of PVDF powder to DMF solvent is 1:6, nano-SiO 2 The particles account for 5% of the PVDF powder mass;

[0067] Preferably, the power of ultrasonic dispersion is 750W, and the time of ultrasonic dispersion is 30min; the stirring speed of mechanical stirring is 2000rpm, and the stirring time is 30min.

[0068] (2) SiO obtained in step (1) 2 / PVDF mixed solution is subjected to defoaming treatment, then poured into a mold and placed in a ventilated environment on a constant temperature platform at 80°C for 2.5 hours to obtain the first composite film;

[0069] (3) The first composite film is taken out from the mold and subjected to hot-pressing treatment. The ho...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a flexible piezoelectric composite film and a preparation method thereof, and belongs to the technical field of composite material preparation. In the invention, nano-SiO2 particles are added to PVDF, crystalline phase transformation is promoted by adopting a high-rate uniaxial tensioning method, the content of beta phase in the PVDF material is increased, then two sides ofa film are coated with conductive silver paste electrodes, and the material is polarized at a high voltage and thus the material hs excellent piezoelectric property. The preparation method disclosedby the invention has high operability and is easy to control, and the prepared composite film product has good quality.

Description

technical field [0001] The invention relates to the technical field of composite film preparation, in particular to a flexible piezoelectric composite film and a preparation method thereof. Background technique [0002] With the rapid development of integrated circuit technology and the continuous improvement of the energy harvesting efficiency of piezoelectric materials, it is possible to realize self-powering of low-energy devices such as wireless sensors by harvesting energy from the environment. Currently, these low-energy electronic components and devices are often powered by batteries or cables. However, the traditional power supply method has many disadvantages, such as difficult cable layout, regular replacement of batteries, and large environmental pollution. Moreover, with the widespread use of information equipment such as sensors, these devices are numerous in number and widely distributed, and the operating environment is sometimes very harsh. If batteries or ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08J7/06C08J5/18C08L27/16C08K3/36
CPCC08J5/18C08J7/06C08J2327/16C08K3/36C08K2201/011
Inventor 赵旸周袁卫锋
Owner SOUTHWEAT UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com